Solder Paste Inspection | 3D SPI

Conformal Coating Inspection

Check out the new media library

Here you can download product brochures, white papers, case studies and more

> To the media library


Outstanding Test Depth Combined with Rapid Test Speed

You are here:

S3088 ultra gold: State-of-the-art 3D inspection with innovative camera technology

By loading the video, you accept the YouTube privacy policy.

Learn more
Load video

Leading manufacturers of high-end electronics worldwide rely on the S3088 ultra gold inline inspection system from Viscom. This high-throughput 3D AOI solution guarantees the most reliable quality assurance in electronics production. The high-speed system can be used for solder paste, solder joint and component inspection. Eight angled cameras in combination with an integrated fringe projector ensure outstanding precision and unique 3D performance. The S3088 ultra gold can be intelligently networked and provides clear, true-to-life test information.

Inspection scope

  • Maximum error coverage: 9 views plus 3D measurement
  • Viscom fast-flow handling with module change in up to 2.5 seconds
  • Impressive high-performance XMplus camera
  • Unique analysis of QFN, DFN and QFP dewetting by oblique view cameras
  • Image data rate of up to 3.6 gigapixels per second
  • Field of view size of 50 mm x 50 mm and inspection speed of up to 65 cm²/s
  • Tested freedom from slippage thanks to integrated verification
  • Modular camera technology with 3D measuring function
  • Global libraries, global calibration: Transferability to all systems
  • Intelligent software add-ons such as Extended Lifted Lead Detection, Integrated Verification
  • or Viscom Quality Uplink for effective networking
  • Traceability, offline programming, statistical process control
  • Communication with MES systems
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
Components: Up to 03015 and fine-pitch components  
  Solder paste, solder joint and assembly control  
Defects/defect features: Too much/too little solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, twist, imperfect shape  
Optional: Free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter  
System housing: 997 mm x 1600 mm x 1540 mm (W x H x D)
Camera technology: XMplus
Inspection methods: 2D, 2.5D, 3D AOI
Total number of megapixels: up to 121
Oblique view cameras: 8 megapixel cameras
Orthogonal camera: 10 μm
Field of view size: 50 mm x 50 mm
Speed: Up to 65 cm²/s
PCB dimensions: 508 mm x 508 mm
User interface: Viscom vVision/EasyPro


  • Future-looking 3D technology
  • Long-term investment security
  • Highly flexible configuring capability, even with changing requirements
  • Easily interpreted height and position values
  • Ideal for fast product changes


A award winning system


Find the right products for your needs:

customer's opinion

“We can recommend the high-quality 3D AOI systems from Viscom to all those who, like us, produce prototypes and small series. Fast product changes can only be economically viable with the shortest possible test plan programming time. We can rely on the software solution from Viscom for this. I have valued our cooperation with Viscom for years for their professionalism and the very high test depth.”
Jens Arnold,
Managing Director, beflex electronic GmbH