High-speed electronic assembly inspection in 3D
S3088 ultra: flexible and cost-effective solder joint measurement
A rapid testing speed and the fastest handling times are some of the advantages of the S3088 ultra, which enables especially cost-effective mass production as well as small series with quick product changes in the field of high-end electronics. The high-speed 3D AOI system also stands out for its versatile configuration options that ensure high-throughput component and solder joint inspection in SMD manufacturing. Reliable quality assurance is guaranteed thanks to the system’s high degree of inspection precision and end-to-end defect coverage. False calls due to human errors are prevented by the integrated verification. Processes can be automated by networking the S3088 ultra within the line and with MES systems.
INSPECTION SCOPE
- Powerful XM camera technology: especially fast inspection with high-resolution views and with color 3D analyses
- Scalable, modular camera technology with 3D measuring function
- Image data rate of up to 3.6 gigapixels per second
- Unique analysis of QFN, DFN and QFP dewetting by angled view cameras
- Rapid inspection speeds of up to 50 cm²/s
- Viscom fast-flow handling with module change in as little as 2.5 seconds
- Verified zero defect slippage thanks to integrated verification
- Global libraries, global calibration: transferability to all systems
- Intelligent software add-ons such as Extended Lifted Lead Detection, Integrated Verification or Viscom Quality Uplink for effective networking
- Traceability, offline programming, statistical process control
- Communication with MES systems
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
| Components: | up to 03015 and fine-pitch components |
| Solder paste, solder joint and assembly control |
| Defects/defect features: | excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component inverted, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape |
| Optional: | free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter |
| DIMENSIONS | |
| System housing: | 997 mm x 1600 mm x 1540 mm (W x H x D) |
| INSPECTION | |
| Camera technology: | XM |
| Inspection procedure: | 2D, 2.5D, 3D AOI |
| Megapixels: | up to a total of 65 |
| Angled view cameras: | 4 megapixel cameras (8 optional) |
| Orthogonal camera: | 8 μm resolution |
| Field of view size: | 40 mm x 40 mm |
| Inspection speed: | up to 50 cm²/s |
| HANDLING | |
| PCB size: | 508 mm x 508 mm |
| SOFTWARE | |
| User interface: | Viscom vVision/EasyPro |
Advantages at a glance
- For the highest throughput requirements
- Ideal for fast product changes
- Integrated verification for fewer false calls
- Very flexible system configuration
Downloads
Find the right products for your needs:
System configurations and options
Customer feedback
“The unique 3D and software features were decisive factors in choosing our AOI system from Viscom. The excellent measurement accuracy and exceptional image quality were verified by further testing.”
Johan Lieten, Sales & Logistics Manager at ACE electronics N.V.
