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Viscom Technology Forum 2021
Know-How, Discussion and Inspiration

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The Top Digital Event by and for Experts in Electronics Manufacturing

Join us on June 29-30, 2021 for a diverse and exciting online event!
Take advantage of this knowledge platform for your own applications. Our sales, applications and service representatives will be there digitally to talk to you and answer any questions you might have.

Our program for June 29, 2021

Automatic Optical Inspection in Practice
 

Opening

09:00 - 09:15 CESTOpen Welcome Lounges
09:15 - 09:30Executive Board welcome greeting
Event platform presentation
 

 

Workshop Sessions

09:30 - 10:05Process Control in Day-to-Day Work – Examples from vSPC
Statistical evaluations of inspection results are used for ongoing monitoring of individual production steps and optimizing inspection programs, among other purposes. As part of the intuitive vVision operating software, vSPC offers you a comprehensive package of tools for statistical process control. In his workshop, Detlef Beer, head of product development at Viscom, shares insights on the requirements of vSPC and the opportunities it offers, as well as presenting best practice solutions.
 
orCreating and Optimizing Inspection Programs Fast with vVision
When you're dealing with frequent product change-overs in electronics manufacturing, you need to be able to quickly create inspection programs for both optical inspection (3D AOI) and inline X-ray inspection (3D AXI). This includes being able to use PCB data to have programs generated fully automatically with the help of 3D algorithms and for all component dimensions to be identified autonomously. In this workshop, Viscom application specialist Eugen Ilin demonstrates fast and easy tools that you can use to create inspection programs, as well as how to use Viscom's user-friendly vVision software to optimize your programs.
 
10:10 - 10:45Highlights of the New SI 9.0 Release and Details on the Update
The SI 8.80 release already gave Viscom’s customers innovative tools such as a powerful 3D THT inspection algorithm, 3D AOI verification from any perspective and 3D AXI software that was even simpler to use. The new SI 9.0 release came out in March 2021, and this workshop provides an overview of its highlights and key functional improvements. Andreas Schlüter, senior application specialist – product development at Viscom AG, also explains the steps that are required for a reliable update to the Viscom inspection systems.
 
orvVision Operating Software – Current Situation and Outlook
The requirements for standard apps we use on our smartphones also apply to inspection systems in electronics production – they both have to be intuitive to use. Viscom’s vVision software meets this requirement in an especially effective way. The workshop starts by offering a quick recap of the highlights of the current vVision 2.8 release. Detlef Beer, head of product development at Viscom AG, will then share the details on what’s included in the new 2.95 release which has been moved forward, and offers a look ahead at the upcoming 3.0 release.
 
10:45 - 11:00Coffee break and expert chat

 

Workshop Sessions

11:00 - 11:353D Solder Joint Inspection with the VEG105 Frame Grabber
In today's fast line cycle times, how accurately can you automatically perform solder joint inspections to see whether the solder joints on even the smallest of electronic components are normal or too thin? Dr. Taras Vynnyk, a senior product developer at Viscom, understands the need for smart and powerful optical inspection (3D AOI) and knows what solutions the industry wants. In his workshop, you will learn about new possibilities and strategies in 3D solder joint inspection, as well as Viscom's phenomenal High Speed Mode, made possible by the new VEG105 frame grabber and other technologies.
 
or Capabilities of Current High-Resolution Optical Camera Technology
Join us on a journey through the smallest structures on a PCB. We take you there thanks to optical technology that basically nothing can escape. Viscom application specialist Dennis Göden presents the latest high-resolution camera technology from Viscom in this workshop, along with this technology’s vast range of applications. The trend toward miniaturization is continuing in the electronic circuits area, so inspection systems have to offer ever-higher resolution and image quality. Today’s systems need to reliably capture even features that are smaller than 25 μm. This means that every test area has to be adequately lit, among other factors. A wide range of variable lighting makes the smallest details visible.
 
11:40 - 12:15Getting through Audits with Confidence: Calibration Tools and Their Certification
The demands placed on inspection systems in electronics manufacturing are constantly increasing. In addition to machine capability testing (MCT), measuring system analyses (MSA) have to be available and the calibration resources must be certified during audits. Detlef Beer, head of product development at Viscom AG, is there to guide you through the jungle of normative test procedures and the calibration hierarchy. An experienced specialist, Detlef gives you a very practical look at how you can ensure the information provided by your measuring technology is traceable for the auditing process.
 
orUsing AI for Quality Control in Electronics Manufacturing
Artificial intelligence (AI) and deep learning are based on artificial neural networks. This workshop presented by Andreas Pösch, data scientist at Viscom AG, starts off with a brief technical introduction to this multifaceted topic by asking: How are classifiers trained, and how can a very high level of detection reliability be achieved? The workshop will then focus on quality control in electronics production, an area where AI can support the operation of the system, for example by facilitating even more reliable decisions when verifying inspection results.
 
12:15 - 13:00Lunch break and expert chat

Presentations

13:00 - 13:35The Latest in 3D SPI Technology — an Overview
3D solder paste inspection is the pace-setter in process optimization, providing rapid print monitoring, precise defect detection and smart process control. In this presentation, Rebekka Malten, Category Sales in Customer Care Team CP (Conformal Coating and Paste Inspection) at Viscom, and Abdulla Raufi, CP application engineer, showcase the unique features of this system, including how cutting-edge camera technology and software provide even more reliable defect detection and how the inspection system is intelligently linked to other machines in the production line to simplify classification, reduce human error and boost FPY.
 
13:40 - 14:153D AOI in Perfect Concert with Production Processes
Automatic optical inspection (3D AOI) as used today in modern electronics manufacturing is built on a number of foundational pillars: The system uses its cameras to generate data about the inspected component. If abnormalities are detected, they are displayed via the classification station. Beyond detecting defects, statistical software allows process weaknesses and potential improvements to be identified quickly. To achieve optimal integration of the quality inspection in the production processes, all this data also flows into the offline programming process. In this talk, Viscom applications expert Tino Missbach takes a strategic look at using 3D AOI efficiently and effectively.
 
14:20 - 14.55Conformal Coating Inspection for Maximum Product Reliability
Learn about the benefits of combining surface-based and component-based automatic optical inspection of conformal coatings and learn more about the fast programming and reliable verification provided by the system featured in this presentation. In this talk, Rebekka Malten, category sales in Customer Care Team CP (Conformal Coating and Paste Inspection) at Viscom, and Abdulla Raufi, CP application engineer, demonstrate how you can use this approach to reliably and cost-effectively achieve maximum inspection quality and simultaneously reduce personnel workloads. Conformal coating plays an important role in electronic assemblies that perform safety-critical tasks and protects against moisture, corrosion, contamination and more.
 
orThe Next Generation of Wire Bond Inspection
In addition to its well-known 2D inspection solutions, Viscom has developed an innovative wire bond inspection for all three spatial dimensions. Viscom application specialist Melanie Wons and Wolf Rüdiger Pennuttis, category sales manager at Viscom, provide a vivid insight into how this new technology can further reduce false calls. The 3D wire bond inspection delivers crucial new quality indicators for thick and thin wires alike and can be put to highly effective use while keeping pace with the production line.
 
14:55 - 15:10Coffee break and expert chat 
15:10 - 15:45Effectively Using THT and Pin Inspection in Your Processes
The way towards achieving a high first pass yield by means of cutting-edge 3D inspection technology has long been paved in THT and pin inspection. Juergen Hoeren, AOI process owner at Robert Bosch Elektronik GmbH Salzgitter, and Tino Mißbach, senior application engineer at Viscom, shed light on the full range of options available today for inspecting PCB undersides, as well as how these can be integrated into important traceability processes. Particular attention will be paid to special inspections in the areas of male multipoint connector measurement and solder ball inspection.

 

Future Talk

15:50 - 16:25Don't Predict the Future, Create It — Trend Scouting and Foresight for Business Practice
From artificial intelligence to electromobility to the circular economy, the world is changing. Implementing trend scouting and foresight as company strategy today helps to ensure competitiveness tomorrow. Mechanical engineering has always been an innovation-driven industry adopting the latest trends – "Production for Future" is the goal because it is actually machines making future products a reality. Metrology plays an important role in this. Dr. Eric Maiser, Chief Futurist at VDMA, the German Mechanical Engineering Industry Association, uses practical examples to show how the “look into the crystal ball” can succeed for the next 10-15 years.
 
16:25 - 16:40Closing remarks and preview

 

"The digital Technology Forum 2021 offers many interesting workshops, including a presentation of our new releases, tips and tricks for operating our systems and the fundamentals of inspection technology — discussion and consultation included."
Detlef Beer
Head of Product Development, Viscom AG

Our program for June 30, 2021

Manual and Automatic X-Ray Inspection in Practice

Opening

09:00 - 09:15 CESTOpen Welcome Lounges
09:15 - 09:30Executive Board welcome greeting
Event platform presentation

 

Workshop Sessions

09:30 - 10:05Advanced 3D AXI Features for SI Users
The name TopAXI refers to an advanced inline X-ray inspection method for voids and THT fillings that offers new possibilities. In this workshop from Viscom application specialist Mariano Perea Perez, you will learn about the functions offered by these new algorithms, examples of how they can be applied, and how using an optional height sensor can add speed and efficiency to the steps of the 3D AXI inspection process. The workshop will also present and examine in detail the foundations and constraints necessary for practical use.
 
10:10 - 10:453D AXI Keeps Pace with the Production Line – the New Speed-up Evolution 5
Systems used on production lines have to be compatible with cycle times. The same applies for the powerful tomographic inline X-ray (3D AXI) that has become an established means of quality control for electronic products in particular. Dirk Nülle, a lead developer at Viscom, offers an insight into current 3D AXI technology and presents Viscom’s new product, Evolution 5. This special capture mode facilitates rapid reconstruction, delivering extremely high-quality images. Among other things, this provides very informative layer images, so fault detection is reliable in every respect.
 
10:45 - 11:00Coffee break and expert chat
11:00 - 11:35Boosting System Performance with Machine Upgrades
Replacing the camera module in an older inspection system with new Viscom camera technology increases throughput by up to three times overall. In his workshop, Jens Czaja, head of training at Viscom, explains the upgrade options available to Viscom’s customers for their hardware and the advantages that come with retrofitting contemporary high-end technology. Whether for automatic optical inspection (AOI) or inline X-ray (AXI) – by taking these steps, customers can achieve better inspection quality, higher throughput rates and faster, more convenient system operability, among other advantages. Viscom also offers the right components in the wire bond inspection area so the relevant machine can be brought up to the state of the art.
 
11:40 - 12:15The New Inspection Report for Offline X-ray
The XMC Inspection Report was specially developed for manual X-ray inspection systems in the Viscom X80 (MXI) series. This smart new tool generates a document with inspection images and key information – such as settings for the X-ray tube and the detector, production flaws detected on the inspection object and the level of the radiation dose. The PDF summary makes it possible to provide both colleagues and customers with a quick and clear overview of all the information they need. In his workshop, Viscom application specialist Michael Fuhl shares all the key details on the XMC Inspection Report for those interested in this solution.
 
or From Hermes to CFX to Standard Data Interfaces
Electronics manufacturing is more networked and connected than ever before, and data exchange between machines from different manufacturers is becoming increasingly important. Viscom has been a supporter of the Hermes Standard protocol (IPC HERMES 9852), the IPC CFX (Connected Factory Exchange) communications standard and other initiatives from the very start. In this workshop Detlef Beer, head of product development at Viscom AG, talks about the experiences and prospects of these very welcome new developments in interface communication. The second part of the workshop will deal specifically with local MES connections and standard data interfaces on Viscom systems using application examples.
 
12:15 - 13:00Lunch break and expert chat

Presentations

13:00 - 13:35X-ray Inspection of Lithium-Ion Batteries
X-ray inspection plays an incredibly important role in the mass production of lithium-ion batteries today. Viscom responded to these unique requirements by specially developing suitable systems. The company’s product range extends from lab machines through to complete inline solutions for 100% quality control at high throughput rates. Viscom’s battery inspection experts Hagen Berger and Markus Möller offer a fascinating insight into the opportunities these products offer for various cell formats in many different types of end user products.
 
13:40 - 14:15Effectively Handling a Wide Variety of Inspection Objects with AXI Innovations
The quality assurance needs of many manufacturers of sophisticated electronics have long included much more than classic PCBs. Diversification has resulted in a growing focus on heavy, enclosed and oversized assemblies and batteries, and with it, demand for precise automatic X-ray inspection capable of handling these products. Peter Krippner, member of the Executive Board responsible for Operations, explains with the help of practical examples how new dynamic 3D image capture methods, versatile handling options and outstanding inspection precision are perfectly meeting the growing variety of quality assurance needs today.
 
14:20 - 14.55MXI Systems: Team Players for Special Tasks
Like a professional team player out on the field, a manual or semi-automated X-ray system from Viscom is ideally prepared for its individual tasks in production, quality control and product development while also being smartly incorporated into the overall strategy. Viscom applications experts Rainer Duhm and Christian Wolff, who are part of the specialist sales team for X-ray systems at Viscom, share examples that demonstrate how the use of an MXI system and networking it with Viscom’s line inspection systems in an intelligent way can boost yield and quality in modern electronics production.
 
14:55 - 15:10Coffee break and expert chat
15:10 - 15:45Reliably Finding and Evaluating Voids in Solder Joints
Demand for reliable and accurate inspection of solder joints for voids and the impact they have on the quality of power electronics has risen steadily over the years. The limits of traditional image processing methods are in some cases already being seen, and the image capture times they provide often present an obstacle that can hardly be ignored. Viscom senior application engineer Mirko Weißgerber and Thomas Winkel from Direct Sales Europe at Viscom present the possibilities offered by rapid and effective void inspection, possibilities which are now realizable with Viscom's 3D AXI systems.
 

Tech Talk

15:50 - 16:25Ensuring Success in Electronics Manufacturing with Innovative X-Ray Inspection
In this panel discussion, our X-ray experts will discuss the requirements placed on quality assurance for hidden structures, both in the offline analysis of defects and in performing 100% inspections within the line cycle time. What are currently the biggest challenges, and which features will become more important in the future? Where are manual and automatic X-ray inspection and computed tomography of most benefit? With the aid of application examples, the panel participants will provide insight into the latest developments and areas of application.
 
16:25 - 16:40Closing remarks

Your contact partners

Martina Engelhardt
Senior Project Manager Exhibitions/Events
Julia Stemme
Junior Project Manager Exhibitions/Events

In parallel to the sessions, there will be many opportunities for networking as well as interaction, and you can put your questions to the Viscom experts from applications, sales and service.