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Reorganization: Profitable Growth Continues Into the Future

From July 1, 2020, Viscom AG has pulled together its customer support for sales, application and service topics into new customer care teams, thus creating new areas of expertise for AOI, AXI, MXI, SPI/CCI, wire bond inspection and for the new battery inspection application area.

Peter Krippner and Carsten Salewski explain this extensive restructuring in a video interview.

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Inspection of the PCB underside now in 3D!

New 3D AOI for THT, Pressfit and SMD components: eight inclined views provide excellent image quality in 3D from all imaginable perspectives. The most advanced 3D camera technology ensures extremely precise inspection.

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The best inspection strategy: 3D AOI and AXI combined in a single system!

Our innovative X7056-II inline solution for high-precision and high-throughput printed circuit board inspection offers you the best inspection strategy. The system guarantees you maximum economic efficiency.

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