Artículos Técnicos

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Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components

Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components

539 KB / PDF
A substantial driver behind mounting and connection technology for electronic assemblies is miniaturization, with its objective of highly integrated systems. Where passive components are concerned, this miniaturization has led to introduction of the compact size 01005. The size 01005 refers to two-pole components (chip resistors and chip capacitors) with dimensions of about 400 μm x 200 μm which, depending on the manufacturer and component type, have heights of about 120 μm to 300 μm. Processing these component sizes places considerable demands on the production process as well as the various inspection stages. Plus, 03/2015
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3D SPI with Process Uplink

3D SPI with Process Uplink

141 KB / PDF
All in one: Fast printer verification and easy process optimization. Case study Smyczek GmbH & Co. KG, Verl, Germany. EPP Europe, 03/2013
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Ensuring highest assembly quality

Ensuring highest assembly quality

1.5 MB / PDF
Manufacture in a relaxed manner: combined optical and X-ray inspection. Case study Rommtech B.V., Halsteren, Netherlands. EPP Europe, 12/2010
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AOI and AXI in one system

AOI and AXI in one system

123 KB / PDF
Combined inspection ensures flexibility and maximum inspection coverage. Case Study Zollner Elektronik AG, Zandt, Germany. EPP Europe, 11/2011
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