Notas de prensa

Viscom presents advantages of 3D bond inspection at electronica

Viscom presents advantages of 3D bond inspection at electronica

With a wide range of inspection systems and camera modules, Viscom AG is offering outstanding solutions for fast, high-precision wire bond production inspections. At the electronica trade show in Munich from November 13-16, visitors can experience firsthand what 3D measurement contributes to product quality in this field.
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User-friendly inspections of protective coatings with the S3088 CCI system by Viscom

User-friendly inspections of protective coatings with the S3088 CCI system by Viscom

Over the years, humidity, moisture or extreme temperature fluctuations can adversely affect electronic assemblies. To ensure that PCB assemblies work faultlessly for a long time, certain areas can be given conformal coatings during production. At the electronica trade show in Munich from November 13-16, Viscom AG offers a comprehensive look at how easily the inspection of these coatings works with the S3088 CCI system.
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3D solder joint inspection with eight angled cameras meets the highest quality standards

3D solder joint inspection with eight angled cameras meets the highest quality standards

At electronica 2018 in Munich, Viscom AG is presenting its successful S3088 ultra gold system in the field of 3D automatic optical solder joint inspection. The intelligently networkable inline inspection system provides clear, accurate and realistic inspection information, thus enabling optimal quality assurance for electronic assemblies.
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Manual X-ray inspection by Viscom, intelligently networked and with cobots

Manual X-ray inspection by Viscom, intelligently networked and with cobots

Manual X-ray inspection (MXI) will remain an important part of quality assurance in electronics manufacturing in the future. Viscom AG will demonstrate at the electronica trade show in Munich from November 13-16 how sophisticated the operation of such a system is and how extensively it can already be networked today.
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Multi-award-winning ultra-fast inspection system for concealed solder joints

Multi-award-winning ultra-fast inspection system for concealed solder joints

For in-line X-ray inspection (3D AXI), Viscom AG has developed the extremely fast printed circuit board transport system xFastFlow. This innovative solution is used in Viscom's X7056-II inspection system, which has won multiple awards and which can be seen at the electronica trade show in Munich from November 13-16.
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Viscom implements groundbreaking 3D technology across its entire product range

Viscom implements groundbreaking 3D technology across its entire product range

Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.
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Viscom is a member of the Fuji Smart Factory

Viscom is a member of the Fuji Smart Factory

Viscom AG is officially involved in the Fuji Smart Factory. The Fuji Corporation initiative aims to standardize communication between machines in electronics manufacturing. For this purpose, the production lines are connected to the company's Nexim software.
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In-line inspection of LED lights up to 2000 mm with very high accuracy

In-line inspection of LED lights up to 2000 mm with very high accuracy

For extra-long electronic assemblies, Viscom offers inspection solutions that realize demanding handling tasks without a problem. Their high inspection accuracy, wide inspection scope and rapid inspection speed predestine the 3D AOI and 3D SPI systems from Viscom for high-end electronics – particularly for LED lights.
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Viscom tests cobot as operator of manual systems

Viscom tests cobot as operator of manual systems

Viscom is currently testing the collaborative robot Sawyer. The cobot can interact with the company's manual inspection systems completely independently. It can be used as a machine operator and can load and unload the 3D MXI system X8011-II PCB without human intervention, for example.
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NETA SMT active as new Viscom AG partner in the Czech Republic and Slovakia

NETA SMT active as new Viscom AG partner in the Czech Republic and Slovakia

Viscom AG is now represented by a sales partner in the Czech Republic and Slovakia. The company NETA SMT s.r.o. has taken on exclusive sales and service representation for the entire product line in both countries. The contract was signed at the SMT Hybrid Packaging in Nuremberg.
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Viscom is World Market Leader Champion 2018

Viscom is World Market Leader Champion 2018

Viscom AG has just been listed as World Market Leader Champion 2018 in the World Market Leader Index (WMFI) of the University of St. Gallen and Academy of German World Market Leaders.
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