Viscom extends invitations to the Technology Forum and User Meeting 2016

Hanover, April 2016  The dates for this year's Technology Forum and User Meeting from Viscom have been set to the 8th and 9th of June. The presentations alone make participation worthwhile. An exclusive workshop program awaits Viscom customers. New interested persons can gain information in tutorials designed especially for them. A colorful entertainment program will round out the two-day event.

Just as in past years, the Technology Forum and User Meeting 2016 offers many opportunities for exchanging knowledge and experience. The contents are tailored to those guests who already use Viscom systems, but they are also directed to participants who are interested in inspection solutions from the company and would like to learn more about them.

Numerous workshops are open to Viscom customers. You can also arrange appointments to discuss specific questions within the offer "Meet the Expert". Those who have not yet gained experience with the Viscom systems can receive relevant information, for instance, about the important criteria for selecting an inspection system in a series of tutorials.

In addition to the practical examples, research is on the agenda at the Technology Forum and User Meeting 2016. A presentation from the Landshut University of Applied Sciences explores current studies of potential application areas for ribbon and bond connections. Two additional presentations are concerned specifically with solder joints. One of these investigates the influence of pores on the reliability of LED solder joints. Partners in this project are the Aschaffenburg University of Applied Sciences, the Fraunhofer Applications Center for Resource Efficiency and the Chair for Factory Automation and Production Systems (FAPS) of the Friedrich-Alexander-Universität Erlangen-Nuremberg. The goal of the study is to investigate application-specific limit values for the amount of pores in solder joints. Another presentation focusing on solder joints will deal with the influence of solder paste pressure on reliability of solder joints in critical ceramic SMD components on FR4 printed circuit boards. This involves an initiative of the Fraunhofer Institute for Silicon Technology (ISIT) that was concluded last year.

Murat Günak will hold the opening talk. Based on his experiences as head designer for leading automobile groups such as Peugeot, Daimler and Volkswagen, he will devote his presentation to what is now a red-hot topic, E-mobility, and to the effect of future mobility concepts, to give us an exciting view of the future of automotive development.

Viscom also will present its own interesting developments. One important topic is Industry 4.0 and how it is put into practice at Viscom. A report from among the Viscom users, by DELTEC Automotive GmbH & Co. KG, illuminates the networking and digitalization of inspection gates to achieve a stable series process.

Viscom looks forward to welcoming many interested participants. A blend of informative specialized presentations, practical application examples, and a wide selection of workshops in the context of the User Meeting awaits the guests. And of course, this year again promises a surprise guest to provide entertainment for the traditional evening event.

 

 

About Viscom

Viscom AG develops, manufactures and sells high-quality inspection systems. The portfolio encompasses the complete bandwidth of optical and X-ray inspections. In the area of assembly inspection for electronics manufacturing, the company is among the leading suppliers worldwide. Viscom systems can be configured specific to the customer and can be interlinked. The company headquarters and manufacturing location is in Hanover, Germany. With a wide network of branches, applications centers, service support points and representatives, Viscom is represented internationally. Founded in 1984, since 2006 Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867). Additional information: www.viscom.com

 

 

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