Technical Articles

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Total control with automatic in-line inspection

Total control with automatic in-line inspection

220 KB / PDF
Valuable data and images for attaining a stable process Highly effi cient defect detection is not the only capability that makes automatic inspection systems an indispensable element in electronics production. The information they deliver also helps optimize production processes.
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Building Versatility into High-Throughput X-Ray Inspection

Building Versatility into High-Throughput X-Ray Inspection

1.6 MB / PDF
3D inspection at high speed is just as important for automated X-ray inspection (AXI) as it is for automated optical inspection (AOI). With time-optimized image acquisition technologies and efficient handling, in-line X-ray performance is increasing. There is also the potential to automate manual X-ray inspection (MXI) processes. In the inspection of electronic assemblies, especially for components with hidden solder joints such as BGA or QFN packages, AOI is insufficient. Random samples with MXI are another option, but this is not always the best solution. Where product safety plays an especially crucial role, particularly in the automotive area, a fast, thorough inspection of solder joints is needed. This calls for in-line, high-speed AXI. On these systems, throughput is determined by the inspected assembly handling, since a fully protected housing with mechanical gates is required.
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Electronics production in Europe

Electronics production in Europe

174 KB / PDF
Ensure competitiveness with intelligent inspection concepts and innovative product ideas In the medium term, only those electronics producers that meet the highest quality requirements and optimize their production processes will stay in business. To avoid defects, the causes must be identified and systematically eliminated. Linking various inspection gates creates wide-ranging possibilities for cost optimization and process reliability and permanent improvements in product quality. Constant development of inspection technology is essential.
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Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components

Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components

539 KB / PDF
A substantial driver behind mounting and connection technology for electronic assemblies is miniaturization, with its objective of highly integrated systems. Where passive components are concerned, this miniaturization has led to introduction of the compact size 01005. The size 01005 refers to two-pole components (chip resistors and chip capacitors) with dimensions of about 400 μm x 200 μm which, depending on the manufacturer and component type, have heights of about 120 μm to 300 μm. Processing these component sizes places considerable demands on the production process as well as the various inspection stages. Plus, 03/2015
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3D SPI with Process Uplink

3D SPI with Process Uplink

141 KB / PDF
All in one: Fast printer verification and easy process optimization. Case study Smyczek GmbH & Co. KG, Verl, Germany. EPP Europe, 03/2013
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Ensuring highest assembly quality

Ensuring highest assembly quality

1.5 MB / PDF
Manufacture in a relaxed manner: combined optical and X-ray inspection. Case study Rommtech B.V., Halsteren, Netherlands. EPP Europe, 10/2012
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AOI and AXI in one system

AOI and AXI in one system

123 KB / PDF
Combined inspection ensures flexibility and maximum inspection coverage. Case Study Zollner Elektronik AG, Zandt, Germany. EPP Europe, 11/2011
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