Technical Articles

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Reliable and Fast Conformal Coating Inspection Provides Greater Safety

Reliable and Fast Conformal Coating Inspection Provides Greater Safety

908 KB / PDF
In recent years the conformal coating production process has become increasingly important for electronics manufacturing. In this process, protective coatings are applied to printed circuit boards at a standard thickness ranging from 100 to 200 μm1. The coatings are designed to protect the entire assembly or individual components against environmental factors such as dirt, dust, moisture and condensation, as well as against temperature changes. Protective coatings may also have insulating properties and can be used to protect against electrical breakdown. 2020
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Innovations in Wire Bond Inspection

Innovations in Wire Bond Inspection

811 KB / PDF
A technological shift is coming in wire bond inspection. Viscom is developing a 3D wire bond inspection system which is specifically designed to meet the challenges of wire bonding. The new system features substantially improved sensors, a high image resolution and fast image data processing, and is capable of performing 3D measurements to detect bond wires as thin as 20 μm. 2020
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Benefits of Manual X-Ray Inspection for Medium-Sized EMS and OEM suppliers

Benefits of Manual X-Ray Inspection for Medium-Sized EMS and OEM suppliers

965 KB / PDF
Zero-defect strategies and increased demands on the production of assemblies are making quality assurance in electronics production increasingly important. Continous miniaturization of components, ever higher packing densities and the associated hard-to-view assembly areas, as well as the increased use of components such as BGAs, QFNs and QFPs, pose a considerable challenge when it comes to high-precision quality control. 2020
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Highly informative results with 3D AOI - Quality from all perspectives

Highly informative results with 3D AOI - Quality from all perspectives

217 KB / PDF
In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. From image quality and analysis of results to the networking of inspection data in order to optimize production processes, the technologies used continue their relentless development.
EPP, 11/2019
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Fast in-line X-ray secures quality

Fast in-line X-ray secures quality

1.1 MB / PDF
High-quality systems for automatic optical inspection (AOI) of electronic assemblies offer as standard features both high throughput and 3D. For hidden solder joints, more and more electronics manufacturers want to employ in-line X-ray systems (AXI) as well. Again, it comes down to fast assembly handling and first-class 3D image quality. One example is the secure detection of voids as required in manufacturing of products with light-emitting diodes (LEDs) and other applications.
EPP Europe, 11/2018
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Total control with automatic in-line inspection

Total control with automatic in-line inspection

220 KB / PDF
Valuable data and images for attaining a stable process Highly effi cient defect detection is not the only capability that makes automatic inspection systems an indispensable element in electronics production. The information they deliver also helps optimize production processes.
EPP Europe, 05/2018
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Building Versatility into High-Throughput X-Ray Inspection

Building Versatility into High-Throughput X-Ray Inspection

1.6 MB / PDF
3D inspection at high speed is just as important for automated X-ray inspection (AXI) as it is for automated optical inspection (AOI). With time-optimized image acquisition technologies and efficient handling, in-line X-ray performance is increasing. There is also the potential to automate manual X-ray inspection (MXI) processes. In the inspection of electronic assemblies, especially for components with hidden solder joints such as BGA or QFN packages, AOI is insufficient. Random samples with MXI are another option, but this is not always the best solution. Where product safety plays an especially crucial role, particularly in the automotive area, a fast, thorough inspection of solder joints is needed. This calls for in-line, high-speed AXI. On these systems, throughput is determined by the inspected assembly handling, since a fully protected housing with mechanical gates is required.
US-Tech, 03/2018
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Electronics production in Europe

Electronics production in Europe

174 KB / PDF
Ensure competitiveness with intelligent inspection concepts and innovative product ideas In the medium term, only those electronics producers that meet the highest quality requirements and optimize their production processes will stay in business. To avoid defects, the causes must be identified and systematically eliminated. Linking various inspection gates creates wide-ranging possibilities for cost optimization and process reliability and permanent improvements in product quality. Constant development of inspection technology is essential.
EPP Europe, 05/2017
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Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components

Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components

539 KB / PDF
A substantial driver behind mounting and connection technology for electronic assemblies is miniaturization, with its objective of highly integrated systems. Where passive components are concerned, this miniaturization has led to introduction of the compact size 01005. The size 01005 refers to two-pole components (chip resistors and chip capacitors) with dimensions of about 400 μm x 200 μm which, depending on the manufacturer and component type, have heights of about 120 μm to 300 μm. Processing these component sizes places considerable demands on the production process as well as the various inspection stages. Plus, 03/2015
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3D SPI with Process Uplink

3D SPI with Process Uplink

141 KB / PDF
All in one: Fast printer verification and easy process optimization. Case study Smyczek GmbH & Co. KG, Verl, Germany. EPP Europe, 03/2013
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Ensuring highest assembly quality

Ensuring highest assembly quality

1.5 MB / PDF
Manufacture in a relaxed manner: combined optical and X-ray inspection. Case study Rommtech B.V., Halsteren, Netherlands. EPP Europe, 10/2012
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