S3016 ultra - Bottom-Side 3D AOI

Features

3D bottom-side inspection of PCB solder joints

  • Highest Performance
    Brand new powerful 3D XM sensor concept for bottom-side inspection
  • Best Inspection Quality
    Shadow-free inspection due to 8 angled cameras
  • Minimum Time and Training Requirements
    due to Viscom standard software
  • System Flexibility
    Flexible handling of various test object types
  • Optimal Inspection Process Design
    in terms of enhanced PCB handling options
Viscom-Plus
  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Simple, fast operation and inspection program generation with EasyPro/vVision-ready
  • Traceability, SPC, verification, off-line programming, and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
SMDTHT
Presencexx
XY-positionxx
Rotationx
Component heightx
Polarityx
No solder xx
Bad solderxx
Lifted lead/tombstonex
Bridgexx
Pin heightx
Nonwetting pinx
Nonwetting padx
Blow holex
Optional:
Open area analysisWobble circle errorColor ring analysis
OCRAir holes in the 
soldered connection
Solder ball/solder spray

 

 

Options
  • Connection to horizontal interfaces along the production line
    • Viscom Quality Uplink – Intelligent networking of Viscom inspection systems along the production line
    • Viscom Closed Loop – Intelligent communication of Viscom inspection systems with paste printers and placement machines
    • Production line control and product traceability
    • Flexible integration of additional production-relevant modules: buffers, label printers, etc.
  • Connection to vertical interfaces for communication with MES systems
  • Flexible single- or multi-line verification solutions
  • Statistical process control Viscom SPC / vSPC
  • Offline programming stations for increased efficiency
Specifications
Inspection scope3D AOISelective and wave soldering, standard solder joints according to IPC, press fit
Camera
technology
3D camera technology
Z-resolution:0.5 μm
Z-range:Up to 30 mm (1.2")
Angled view cameras
Number of megapixel cameras:8
Orthogonal camera
Resolution:15 μm
Field of view:50 mm x 50 mm (2" x 2")
SoftwareUser interface:Viscom EasyPro/vVision-ready
Statistical process control:Viscom SPC/vSPC, open interface (optional)
Verification station:Viscom HARAN/vVerify
Remote diagnosis:Viscom SRC (software remote control) (optional)
Programming station:Viscom PST34 (optional)
System computerOperating system:Windows®
Processor:Intel® Core™ i7
PCB handlingTransport type:Single track transport, return transport (optional)
PCB dimensions (L x W):500 mm x 500 mm, minimum width 70 mm (19.7" x 19.7", min. width 2.8")
Transport height:950 - 1000 mm ± 20 mm* (37.4" - 39.4" ± 0.8" );
optional return transport: up to 300 mm (11.8")
Width adjustment:Automatic
Upper transport clearance:Up to 80 mm (3.1")*
Lower transport clearance:Up to 50 mm (2")
Inspection speedUp to 65 cm²/s
Other system dataPositioning/handling unit:Synchronous linear motors
Interfaces:SMEMA
Power requirements:400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 6 bar working pressure
System dimensions:1094 mm x 1620 mm x 1692 mm (43.1" x 63.8" x 66.6") (W x H x D)
Weight:750 kg (1653 lbs)

*Standard configuration, individual adjustments on request

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