X8011-II PCB – 3D MXI
Features
High-performance X-ray inspection for SMT/electronics
- Fully manual or in-line-compatible inspection mode
- Optional open high-performance tubes or low-maintenance closed tubes
- Highest magnifications and excellent image quality
- High-resolution digital flat panel detectors
- EasyClick principle for easy mounting of handling units
- Upgradeable with Viscom computed tomography
Viscom-Plus
- Reliable short-cycle inspections
- Robust inspection strategies using the Viscom standard library for solder joint inspections
- Customer-specific software adaptations possible
- Over 20 years of AXI experience included
- Separate analysis software for BGA, surface defects, THT, QFN
- Independent real-time image processing with Viscom analysis tools
- Intuitive operation and comprehensive analysis features of Viscom XMC and Viscom SI
Specifications
| X8011-II PCB eco | | X8011-II PCB plus | | X8011-II PCB flex | |||
|---|---|---|---|---|---|
| X-ray technology | X-ray tube | Sealed direct beam tube or open microfocus transmission tube (optionally also TXD X-ray tube, < 1.5 μm) | |||
| High voltage | 20 - 130 kV / 20 - 160 kV / 20 - 200 kV | ||||
| X-ray current | 50 - 300 μA / 5 - 1000 μA | ||||
| Target power | max. 20 W / max. 40 W | max. 40 W | |||
| Geometric magnification | max. 35 times / max. 2650 times | max. 2650 times | |||
| Image converter | High resolution 7.3" FPD, 14 bit | High resolution 11" FPD, 14 bit | |||
| Proven resolution (at 90 kV/80 μA) | < 16 - 50 μm / < 4 μm / < 1.5 μm | ||||
| Detector swivel range Additionally via the rotation and tilt axis +/- 45° (90°) | 0° | 0–60° | 0–60° | ||
| X-ray cabinet | Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG), German Radiation Protection Ordinance (StrlSchV), CE mark and additional international standards for worldwide use. Radiation leakage rate < 1 µSv/h | ||||
| Software | User interface | Viscom XMC / Viscom SI optional | |||
| Available software packages | BGA analysis software XVR-CT software (planar, rotary) | ||||
| System computer | Operating system | Windows® | |||
| Monitor | High-resolution 24" LCD display for special depiction of grayscale values in the SMT and electronics sectors (DICOM Standard) | ||||
| Inspection object handling | Manipulator | X-Y-Z | X-Y-Z plus rotation module | ||
| Max. table travel range | Horizontal X/Y-axis: 460 x 435 mm (18.1" x 17.1") Vertical Z-axis: 290 mm (11.4") | ||||
| Max. rotation module travel range | - | X8011-II PCB plus, X8011-II flex Horizontal x/y-axis: 350 x 430 mm (13.8" x 16.9") Vertical z-axis: 290 mm (11.4") n x 360° | |||
| Inspection object weight | Up to 10 kg (22 lbs) (with rotation module, 5 kg/11 lbs) | ||||
| Sample change | Motorized window opening | ||||
| Optional additional axes available | Yes | ||||
| Other system data | |||||
| Power requirements | 230 V (other voltages on request), 1P/N/PE, 16 A | ||||
| System dimensions | Approx. 1144 mm x 2007 mm x 1420 mm (W x H x D) (45" x 79" x 55.9") | ||||
| Weight | Approx. 2100 kg (4630 lbs) | ||||
