Combined AOI/AXI inspection solution for total wire bond inspection and detection of hidden connectors

  • Precise, reliable inspection down to wire diameters of approx. 25 µm 
  • Reliable detection of defective wire paths, dies and component position
  • Combined inspection of wire bonds and SMD placement
  • Secure detection of damaged and misplaced components
  • Inspection of conductive adhesive bond
  • Reliable inspection of hidden connectors
  • Individually adaptable inspection scope
  • Simple operation and inspection program generation with EasyPro
  • Possible to read data matrix code from program flow
  • Viscom Quality Uplink: process optimization and first-pass yield increase
  • Best in-line AXI resolution for the highest defect coverage
  • Versatile camera module selection for thick and thin wires
  • Fast image capture process and short analysis times
  • High-power inspection algorithms for all typical wire bond processes
  • In-line capability enables inspection of rapid throughput
  • Simple operation and inspection program generation with EasyPro
  • Traceability, SPC, verification, off-line programming and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptations
  • User interface available in multiple languages
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 20 years bond experience included
  • Over 20 years' AXI experience included
  • Over 30 years AOI experience included
Defect coverage
Missing componentMissing ball/stitchMissed solder joint
Slanted component (tilt)Ball/stitch position out of toleranceInsufficient solder
Face down componentBall/stitch geometry deviationSolder bridging/short circuit,
general solder defects
Tombstoning"Golf club"Nonwetting
Contaminated componentContaminated padMissing conductive adhesive
X/Y component displacementMissing wedgeConductive adhesive residue
Component rotation out of toleranceWedge rotation out of tolerance
Damaged componentWedge geometry deviation
Incorrect componentWedge position out of tolerance
Excess componentsContaminated land, capillary imprint
Component on its sideMissing wire
Twisted leadDefective wire course
Damaged leadNot enough clearance to adjacent wires, short circuit
Lifted lead
Reversed polarity
THT hole fill
Scratched chip surface
Edge chipping
Open area analysisWobble circle errorElectronic color code analysis
OCRBlow holes in the solder jointSolder ball/solder sputter
Coplanarity inspectionBGA head in pillowWicking effect
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Preparation, filing, and printing of defect logs
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • Automated grayscale value calibration for constant inspection results
  • User-friendly real image display for better verification (AOI)
  • Selective X-ray inspection for process optimization (AXI OnDemand)
X-ray technology
X-ray tubeSealed X-ray tube
High voltage60 - 130 kV
X-ray current50 - 300 µA
DetectorFlat panel detector (FPD), 14-bit grayscale value depth
Resolution8, 10 or 20 μm/pixel, switchable
X-ray cabinet

Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG) and German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h 

Detector configuration1 FPD on xy-table, 5 fixed FPDs (additional on request)
Camera technology
bond module

Number of modules per machine: 1
Number of cameras: 1
Pixel size: 4.5 µm/pixel

User interfaceViscom EasyPro
SPCViscom SPC (statistical process control), open interface (optional)
Verification stationViscom HARAN
Remote diagnosisViscom SRC (optional)
Programming stationViscom PST34 (optional)
Operating systemWindows®
ProcessorIntel® Core™ i7
PCB handling
PCB dimensions450 mm x 350 mm (17.7" x 13.8") (L x W)
Transport height850 - 980 mm ± 20 mm (33.5" - 38.6" ± 0.8")
Width adjustmentAutomatic during setup
Substrate clampingMechancical clamping
PCB support area3 mm (0.1")
Upper transport clearanceUp to 50 mm (2")
Lower transport clearance55 mm (2.2")
Inspection speed
AOIUp to 50 cm²/s
AXIDepending on application
Other system data
Positioning/handling unitSynchronous linear motors
InterfacesSMEMA, SV70, customer specific
Power requirements400 V (other voltages on request), 3P/N/PE, 8 A
System dimensions1266mm x 1626 mm x 2184 mm (49.8" x 64" x 86") (W x H x D)
Line integration dimension+25 mm (1")
Weight2500 kg (5512 lbs)


Subject to technical changes. Windows® and Intel® Core™ i7 are registered trademarks.

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