Duluth, GA, January 2020 — Viscom Inc. today announced that it will exhibit in Booth #3336 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Always at the forefront of innovation for AOI, AXI and SPI, the company will show its X8011-II PCB and X7056-II 3D X-ray inspection systems, along with the S3088 ultra chrome and S3088 DT.
X7056-II automatic 3D X-ray inspection
The award-winning X7056-II automatic 3D X-ray inspection system features extremely high throughput and superb image quality for the requirements in high-end electronics production. This AXI in-line system can ensure precise inspection of hidden solder joints and components in high-volume production. It is equipped with the xFastFlow transport module, which cuts printed circuit board changing times. With this feature, up to three boards can be processed at the same time. The new handling design also means that significantly larger board sizes can be inspected and the scope of angled radiation is extended.
The award-winning S3088 DT is configured as standard with a dual-track system for use in automatic optical inspection (3D AOI). The system features a unique combination of affordability, efficiency, speed and technical performance that meets all the requirements of large-scale mass production today, including, for instance, full connection to state-of-the-art Industry 4.0 interfaces. The S3088 DT ensures reliable inspection of sophisticated 03015 components at an impressive throughput rate.
X8011-II PCB X-ray inspection
The connectors on BGAs, QFNs or QFPs are mostly hidden, and can only be reliably checked with X-ray inspection. The X8011-II PCB high resolution semi-automatic X-ray inspection system was developed especially for these tasks. Typical applications are, for example, the inspection of electronic assemblies and components, quality assurance in power electronics, or non-destructive special inspections.
S3088 ultra chrome
The S3088 ultra chrome is based on Viscom’s unique 3D AOI technology, and combines accurate defect detection with high inspection speed. This makes the system the first choice for efficient SMT production. Some of the market-leading features of the S3088 ultra chrome include inspection speed of up to 65 cm²/s and 65 mega pixels of information in each 50 mm x 50 mm field of view. The resolution is switchable, and with 10 µm per pixel even 03015 components can be reliably inspected. Together with the eight angled-view cameras, a virtually shadow-free 3D inspection is one of the key advantages of the system.