Multi-award-winning Ultra-fast Inspection System for Concealed Solder Joints
Hanover, Germany, November 2018 – electronica, hall A3, stand 642 – For in-line X-ray inspection (3D AXI), Viscom AG has developed the extremely fast printed circuit board transport system xFastFlow. This innovative solution is used in Viscom's X7056-II inspection system, which has won multiple awards and which can be seen at the electronica trade show in Munich from November 13-16.
The X7056-II by Viscom eminently meets the demand of electronics manufacturing companies for the combination of extremely fast assembly handling with optimal quality control. Moreover, the inline X-ray system can be extended with additional automatic optical inspection (3D AOI) within its existing housing. With xFastFlow the machine achieves handling times (infeed and outfeed of the object to be inspected) of down to four seconds. Up to three printed circuit boards can be processed simultaneously in the 3D AXI system.
High-performance flat-panel detectors — depending on the configuration either fixed or movable — ensure top-quality 3D X-ray images. With the help of planar computer tomography, both horizontal and vertical layer images that no longer show any disruptive structures, in contrast to 2D results, can be extracted from the data volume. For example, a slice-by-slice view into the interior of an array of BGA balls is possible. "Head-in-pillow" errors in BGA components or voids in surface soldering are quickly and reliably detected. Depending on the requirements, inspection depth and throughput, as well as 3D and 2D inspection, can be combined as desired.
The inspection system is operated with the extremely user-friendly vVision software from Viscom and offers outstanding networking options within quality assurance processes during manufacturing — perfect for Industry 4.0 and smart factories. The X7056-II has already won four international awards: the productronica innovation award 2017 (Inspection & Quality Cluster), the CIRCUITS ASSEMBLY 2018 New Product Introduction (NPI) Award (Test & Inspection – AXI), the 2018 SMT China VISION Award (Inspecting & Testing – AXI) and an EM Innovation Award from Electronics Manufacturing Asia, likewise presented in 2018.
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