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iX7059 Device Inspection – Innovative X-ray inspection for maximum product quality and process efficiency
The iX7059 Device Inspection 3D X-ray system offers an economical and effective solution for the fast and reliable final inspection of a wide range of devices and applications that need to function smoothly in everyday life. Potential applications typically include smartphones, tablets, notebooks and desktop PCs, battery management systems, and cartridges for medical and industrial use.
Whether used in the production line or as a cellular concept, the system detects hidden defects such as foreign objects that can lead, among other things, to defective soldered and welded joints, short circuits, or missing components that may later affect proper functionality. The iX7059 Device Inspection is robust and easy to maintain, and is designed to operate without restriction for 24 hours a day. Its short cycle times, high inspection depth, and the option for planar CT (3D) ensure adherence to high quality standards while operating at maximum efficiency.
Networking the iX7059 Device Inspection with other Viscom systems in the production line makes it possible to benefit from the various possibilities of effective process control. Process steps can be statistically monitored and documented with powerful Viscom tools that allow for the intelligent analysis of inspection results. Inspection programs are quick and intuitive to create and optimize, which is a considerable advantage for a variety of situations, such as when you need to change products frequently.
Inspection Scope
- Seamless, perfect handling of assemblies – even for very large products measuring up to 200 kg and 2 meters in length
- Powerful X-rays with 130 kV or optionally 180 kV
- High-precision inspection in 2D, 2.5D and 3D
- High-quality 3D AXI volume calculation with planar CT
- Additional vertical slices for optimum analyses and dependable verification
- Global libraries, global calibration: transferability to all systems
- Automated grayscale value calibration for consistent inspection results
- Traceability, statistical process control, offline programming, multiline verification
- Viscom Quality Uplink: effective networking and process optimization
- Interfaces: SMEMA, IPC Hermes Standard (optional)
| Scope of inspection: | air inclusions (voids) in soldered and welded joints, presence, offset, foreign material, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, etc. |
| DIMENSIONS | |
| System housing: | 1493 mm x 1654 mm x 2207 mm (58.8" x 65.1" x 86.9") (W x H x D) |
| X-RAY TECHNOLOGY | |
| X-ray tube: | Sealed microfocus X-ray tube |
| High voltage: | 130 kV (up to 180 kV optional) |
| Detector: |
Flat panel detector type FPD T2 (FPD T3 optional), 14-bit grayscale depth |
| Resolution: | 5 – 39 µm/pixel |
| INSPECTION | ||
| Inspection procedure: | 2D, 2.5D, 3D | |
| HANDLING | ||
| iX7059 Device Inspection | iX7059 Device Inspection XL | |
| Inspection object dimensions: | up to 610 mm x 600 mm (24" x 23.6") (L x W)* | up to Up to 2000 mm (78.7") (L)* |
| Inspection object weight: | Up to 10 kg (22 lbs) | Up to 200 kg (441 lbs) |
| SOFTWARE | ||
| User interface: | SMEMA, IPC Hermes (optional) | |
| *Depending on configuration |
Advantages at a glance
- Fast and reliable inspection ensuring top product quality
- Handles devices up to 200 kg and 2 meters in length
- Welding and cavity detection of various materials
- Seamlessly integrated for streamlined process control
- Customized solutions for every inspection challenge
