Cost-Effective Quality Assurance in Mass Production
iS6059 PCB Inspection – first-class inspection results for efficient SMT manufacturing
The iS6059 PCB Inspection combines the advantages of special high-speed 3D camera technology with excellent inspection quality and extremely fast inspection speed. The 3D AOI system, which was developed for the economical large-scale production of assemblies, reliably inspects both components and solder joints. Within the manufacturing process, it can be intelligently networked for Industry 4.0 applications.
Inspection scope
- Robust system design
- Ideal system configuration with respect to costs/benefits
- High inspection speed
- One orthogonal camera and eight angled-view cameras provide virtually shadow-free 3D inspections
- Verified zero defect slippage thanks to integrated verification
- Flexible integration into existing productions
- Improved ergonomic design
- Global libraries, global calibration: transferability to all systems
- Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking
- Traceability, offline programming, statistical process control
- Communication with MES systems
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- optional connection to the digital multi-purpose platform vConnect
| Components: up to 03015 and fine-pitch components |
| Solder paste, solder joint and assembly control |
| Defects/defect features: excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape |
| Optional: free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter |
| DIMENSIONS | ||
| System housing: | 997 mm x 1756 mm x 1753 mm | |
| (39.3" x 69.1" x 69") (W x D x H) | ||
| CAMERA TECHNOLOGY | XMs-II | XM8-II |
| 3D sensor technology | ||
| Z-resolution: | 0.5 µm | 0.5 µm |
| Z-range: | Up to 30 mm | Up to 30 mm |
| (1.2") | (1.2") | |
| Angled view cameras | ||
| Number of megapixel cameras: | 8 | 8 |
| Orthogonal camera | ||
| Resolution: | 10 µm | 8 µm |
| Field of view: | 50 mm x 50 mm | 40 mm x 40 mm |
| (2" x 2") | (1.6" x 1.6") | |
| INSPECTION SPEED | Up to 65 cm²/s | Up to 50 cm²/s |
| HANDLING | ||
| PCB dimensions: | 508 mm x 508 mm (20" x 20"); | |
| long-board option available | ||
| SOFTWARE | ||
| User interface: | Viscom vVision/SI EasyPro | |
| Statistical process control: | Viscom vSPC/SPC, open interface (optional) | |
| Verification station: | Viscom vVerify/HARAN | |
| Remote diagnosis: | Viscom SRC (optional) | |
| Programming station: | Viscom PST34 (optional) |
Advantages at a glance
- IPC-compliant 3D assembly inspection
- Designed specifically for cost-effective mass production
- Meets the most demanding cycle time requirements
- Integrated verification for fewer false calls
