Microelectronics Inspection Solutions

Microelectronics Inspection Solutions play a central role in driving innovation in advanced inspection and quality assurance technologies. Viscom supports semiconductor manufacturers and electronics producers with highly precise inspection solutions for wafer and die-level applications, advanced packaging, power electronics, and material process control. Viscom’s expertise covers wafer surface inspection, defect detection, die alignment, redistribution layers (RDL), microvias (uVias), TSVs, bonding technologies, and 3D package analysis. By combining advanced imaging, metrology, and intelligent process analytics, we help customers achieve maximum reliability, yield optimization, and production efficiency across highly demanding microelectronics environments.  

Our technologies are designed to meet the growing challenges of next-generation semiconductor manufacturing and advanced electronics production. From flip-chip, hybrid bonding, and power module inspection to sinter, gold, and silver paste analysis, we deliver precise process control and defect detection for critical manufacturing steps. We support applications involving DCB, AMB, and ceramic substrates, soldered and sintered interfaces, as well as bond integrity and void detection in power electronics. With a strong focus on innovation, precision, and reliability, we enable our customers to manufacture high-performance electronic components with the highest quality standards.