Wire Bond Inspection

Ensuring Precision in Wire Bond Inspection

Advanced 3D Wire Bond Inspection solutions from Viscom enable the reliable detection of defects in fine-pitch and high-power applications, ensuring precise inspection of bond positions, wire paths, and loop profiles. With high-speed imaging and advanced 3D inspection technology, Viscom systems ensure stable processes, reduced false calls, and consistent quality in demanding electronics manufacturing.

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Wire Bond Inspection

Advanced Inspection Solutions for Wire Bonding

As Wire Bonding moves toward thinner wires, finer pitches, and high-power applications, defect-free inspection becomes essential, especially in automotive and 5G Electronics. Viscom’s 3D Wire Bond Inspection Systems detect bond wires down to 17μm with high precision. Advanced illumination and high-speed camera technology deliver detailed 3D images, reduced false calls, and reliable defect verification. 

The systems support all standard bonding processes, including ball-wedge, wedge-wedge, and security bonds, across materials such as aluminum, copper, silver and gold. Inspection covers bond positions, wire paths, loop profiles, and component placement, while integrated trend analysis and automated defect detection ensure stable processes and continuous quality monitoring. 

Why choose Viscom?

We make technology safe, reliable and sustainable!

40 Years of Expertise

Four decades of inspection know-how, combining deep industry knowledge with proven innovation to deliver trusted inspection solutions.

100% Defect Detection

Always advancing with the latest inspection solutions to achieve the highest detection rates and support zero-defect manufacturing.

Award-Winning Inspection Solutions

Industry-leading inspection systems recognized worldwide for outstanding performance, precision, and reliability across every production stage.

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FIND THE RIGHT INSPECTION SOLUTION FOR YOUR Manufacturing process

Benefit from Viscom's award-winning inspection technologies and our global support from experts.

Products

iS6059 Wire Bond Inspection

With the iS6059 Wire Bond Inspection system, Viscom offers the best inline technology and top performance for the automatic optical inspection of wire bonds. Where high throughput is a must, dual-track operations can significantly cut inspection times.

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iX7059 One

In the pursuit of excellence, precision is non-negotiable. With the iX7059 One, precision is not just a goal; it is a guarantee.

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vConnect - The next step in digital networking

With the vConnect multi-functional platform, Viscom is launching a comprehensive portfolio of modern solutions for high-performing inspection systems. The aim is to reproduce the digital factory as a look-alike of the real factory.

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