Power Electronics Industry

Where Power Meets Inspection Performance

Viscom’s inspection solutions uncover critical defects in power modules, semiconductors, bonding connections, and thermal interfaces. Detailed insights into hidden structures help manufacturers improve process stability and meet the demands of increasingly powerful electronic systems.

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Power Electronics Industry

Advanced X-ray Inspection for Power Electronics

The power electronics industry is under constant pressure to deliver higher performance, greater reliability, and shorter development cycles. As power densities increase and applications in e-mobility, renewable energy, and industrial automation expand, product quality becomes a decisive competitive factor. Critical characteristics such as void rates beneath the DIE in IGBT modules, the integrity of bonding wires in power semiconductors, and the reliable connection of heat sinks directly influence efficiency, lifetime, and system safety. 

As a global provider of inspection solutions, Viscom understands the specific challenges of power electronics manufacturing. With decades of experience in automated inspection and production quality assurance, Viscom supports manufacturers in maintaining transparency across complex production processes and safeguarding the quality of critical power modules and semiconductor assemblies. The result is greater process stability, reliable quality data, and improved production efficiency. Key factors for companies aiming to strengthen their competitive position in a rapidly evolving power electronics market. 

Power Electronics Inspection Solutions

From power semiconductors and IGBT modules to thermal management and electronic assemblies, Viscom’s inspection solutions ensure reliable quality. Our technologies improve process stability, reduce defects, and support efficient manufacturing.

IGBT Modules & Power Semiconductors

We inspect IGBT modules and power semiconductors for voids, bonding wire integrity, and internal defects. Advanced X-ray inspection supports reliable performance and consistent manufacturing quality.

Thermal Management Components

We inspect heat sinks and thermal interfaces for connection quality, alignment, and assembly integrity. Reliable inspection helps improve heat transfer, product lifetime, and process stability.

Power Electronic Assemblies

We inspect power electronic assemblies for solder quality, component placement, and hidden defects. Viscom’s inspection systems reduce rework, improve first pass yield, and ensure reliable production.

Why choose Viscom?

We make technology safe, reliable and sustainable!

40 Years of Expertise

Four decades of inspection know-how, combining deep industry knowledge with proven innovation to deliver trusted inspection solutions.

100% Defect Detection

Always advancing with the latest inspection solutions to achieve the highest detection rates and support zero-defect manufacturing.

Award-Winning Inspection Solutions

Industry-leading inspection systems recognized worldwide for outstanding performance, precision, and reliability across every production stage.

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FIND THE RIGHT INSPECTION SOLUTION FOR YOUR Manufacturing process

Benefit from Viscom's award-winning inspection technologies and our global support from experts.

Applications

Wire Bond Inspection

As Wire Bonding moves toward thinner wires, finer pitches, and high-power applications, defect-free inspection becomes essential, especially in automotive and 5G Electronics.

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Void Inspection

Voids can develop within applications when air, gas, moisture, or contaminants become trapped during the application, dispensing, curing, or manufacturing process.

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Solder Paste Inspection

Solder Paste Inspection (SPI) is a critical process in SMT manufacturing, ensuring precise solder paste deposition on printed circuit boards before component placement.

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ALL applications