Milestones

Our Success Story

Technical expertise and future-oriented engineering based on 40 years of industry experience are reflected in our innovative hardware and software solutions in the fields of solder paste inspection (SPI), automatic optical inspection (AOI), automatic and manual X-ray (AXI/MXI) as well as protective coating and wire bond inspection.

Let us take you on a journey through the Viscom success story.

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2024

Transformation of Viscom AG into Viscom SE

The conversion of Viscom AG to Viscom SE emphasizes Viscom’s European roots and international identity. This strategic decision showcases Viscom’s status as a modern, globally operating company with a diverse workforce.

2023

Introduction of the AOI product series iS6059 with the systems iS6059 SPI, iS6059 PCB Inspection, iS6059 PCB Inspection Plus, iS6059 THT Inspection and iS6059 Double-Sided Inspection.

vConnect – the Viscom remote service offer is launched. It provides transparent status monitoring, informative dashboards, IT services, cloud access, scalable solutions for large volumes of data and integrates data from the IPC/CFX and Hermes industry standards in a comprehensive manner.

vAI – Viscomhas developed three powerful AI solutions to improve processes in production and quality control: efficient Inspection program creation via NPI (New Product Integration), AI-supported image processing and AI-supported verification.

2022

Subsidiary Exacom GmbH founded: For the development and distribution of systems for X-ray inspection of battery cells – for all areas of application, regardless of cell format or size.

2021

Viscom continues international expansion: subsidiaries founded in Bangalore (India) and Huizhou (China).

With its iX7059 product line, Viscom is setting new standards for high-precision 3D inline X-ray inspection. Outstanding inspection performance as well as exact measurement ensure fail-safe quality assurance in modern production.

2019

35 Years of Viscom - 35 Years of Innovation

Viscom invests in three new X-ray laboratories for direct radiation and transmission tubes.

The new S3016 ultra inspects THT, press-fit and SMD components on the bottom side of printed circuit boards with unique 3D sensor technology.

2018

Peter Krippner and Carsten Salewski become new members of the Executive Board. Company co-founder Volker Pape moves to the Supervisory Board.

The new S3088 DT combines high-precision 3D AOI with the highest throughput – developed for large-scale production.

Viscom presents initial solution approaches regarding artificial intelligence for the SMT practice at the Technology Forum 2018.

2017

Viscom AG achieves record revenue

By the end of the fiscal year 2017, revenue increased by 14.6 % compared to the previous year.
With over 400 employees, Viscom reaches  €88.5 million, and continues to grow.

Viscom wins the productronica innovation award for the new X-ray system X7056-II whose exceptionally high throughput and outstanding inspection depth swayed the expert jury.

Viscom Machine Vision Trading Co. Ltd. in China celebrates its 10th anniversary.

2016

Extended range of systems in the 3D AOI area: The S3088 ultra gold system combines pioneering 3D inspection technology with high speed.

Viscom presents the new X-ray inspection systems at NEPCON South China in Shenzhen.

Technology Forum on the premises of the newly constructed Viscom building at Carl-Buderus-Straße 6.

2015

Viscom TrueYield – the unique toolbox for networked optimization of inspection quality and the entire process

2014

Viscom develops X-ray system X8068 for larger electronic assemblies.

Viscom presents the versatile Viscom 3D AOI system S3088 ultra with high-performance sensor technology.

Viscom celebrates its 30th anniversary.
 

2013

Viscom optimizes process control with Viscom Quality Uplink and Total 3D.

Viscom’s S3088 CCI inspects conformal coatings of electronic assemblies.

2012

Development of new high speed camera technology (XM module)

Viscom introduces the new inspection system for 3D solder paste inspection at the SMT.

First systems with the new operating software vVision are delivered.

2011

Best results since the company was founded

Viscom’s S3088 flex replaces the series III of the S3088 family as successor model.

Extension of the product family for wire bond inspection with the system S6056BO-V.

2009

Viscom celebrates its 25th anniversary.

2008

Independent business division Service established.

Viscom Inc. opens an application and training center in Mexico.

Viscom wins several awards in China and the USA.

2007

First of its kind: Optical inspection and simultaneous 3D X-ray inspection with the Viscom X7056

Opening of the new Viscom Application Center in Shanghai attended by Lower Saxony's Prime Minister.

2006

Presentation of the first AOI desktop system S2088.

Viscom Inc., the USA subsidiary, expands into its new headquarters in Duluth/Atlanta, Georgia.

Viscom listed on stock market in May 2006.

2005

Commissioning of the fourth production hall and opening of the training center.

Viscom quality management system certified in accordance with DIN EN ISO 9001:2000.

Development of high-performance 3D computed tomography.

2004

Dr. Martin Heuser and Volker Pape are named "Entrepreneurs of the Year 2003" in Hanover.

2003

First Viscom Technology Forum and User Meeting.

2002

EasyPro – Introduction of the new user interface for Viscom inspection systems

2001

International expansion: Subsidiary in France founded

Change of legal form to German stock corporation

2000

Introduction of the first Viscom wire bond inspection system

Viscom grows – revenue jumps to over €21 million.

1998

Start of international orientation – Subsidiaries founded in the USA and Singapore

Building and moving into two new production halls

1997

Introduction of Viscom's first proprietary X-ray tube

1996

Introduction of the first system worldwide to combine visible light inspection and X-ray inspection (AOI/AXI)

1994

Viscom celebrates its 10th anniversary.

1992

In-house production: relocation to current company headquarters in Hanover-Badenstedt.

1990

Introduction of Viscom 6031, the company's first solder joint inspection system

1989

Major orders from automotive suppliers for electronic assembly inspection systems

1988

First Viscom placement inspection in use

1986

Start of series production – inspection systems for CD inspection

1985

Market launch of image processing software TopPic

Exhibitor at the joint stand of the State of Lower Saxony at the Hannover Messe

1984

Martin Heuser and Volker Pape found the Pape Bildverarbeitung GbR in a 42 m² office at Vahrenwalder Str. 10, Hanover.