Solder Paste Inspection | 3D SPI

Conformal Coating Inspection

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Our Success Story

Technical expertise and future-looking engineering from over 35 years of industry experience stand behind our innovative hardware and software solutions in the fields of solder paste inspection (SPI), automatic optical inspection (AOI), automatic and manual X-ray (AXI/MXI) as well as protective coating and wire bond inspection.

Come with us on a journey through the Viscom success story.

Milestones 2017 to the present

Viscom AG develops the new X7056-II X-ray system, the S3088 DT for high-precision 3D AOI inspection, and the S3016 ultra for precision inspection of the underside of printed circuit boards. The company celebrates record sales in 2017.

Milestones 2017 - present

Milestones 2006 through 2016

Following the IPO in 2006, Viscom continues to expand its product portfolio with
world firsts such as the X7056 for 3D X-ray inspection, the S6056BO-V for wire bond inspection or the flexible S3088 ultra 3D AOI system.

Milestones 2006 - 2016

Milestones 1995 through 2005

Viscom expands internationally and establishes subsidiaries in the USA, Singapore and France. In addition, the inaugural Viscom Technology Forum takes place in 2003.

Milestones 1995 - 2005

Milestones 1984 through 1994

Martin Heuser and Volker Pape found Pape Bildverarbeitung GbR and one year later launch the TopPic image processing software on the market. This is followed by the series production of inspection systems for CD inspection and the introduction of the first solder joint inspection system, Viscom 6031.

Milestones 1984 - 1994