Discover Innovations at electronica 2024 – Viscom SE Showcases Cutting-Edge AOI and AXI Technologies

Hanover, Germany, August 29, 2024 – Preparations for electronica 2024 are in full swing. From November 12th to 15th, 2024, Munich will once again become the center of the electronics industry. Viscom SE cordially invites you to visit our booth (A3-443) and experience the latest innovations in Automatic Optical Inspection (AOI) and Automatic X-ray Inspection (AXI).

At the heart of our presentation are two state-of-the-art inspection systems that set new standards in quality assurance: the iS6059 PCB Inspection Plus and the iX7059 PCB Inspection XL.

The premium AOI system iS6059 PCB Inspection Plus delivers exceptional inspection performance with nine high-resolution views, capturing up to 26% more pixels. With variable lighting, larger inclined image fields, and increased data transfer rates, this system enables up to 25% faster image capture.
Additionally, it offers extensive networking options, perfectly tailored to the needs of modern electronics manufacturing.

The iX7059 PCB Inspection XL sets new benchmarks in the inspection of SMD and THT solder joints. With its precise void measurement capability, it ensures 100% quality assurance in SMT manufacturing. The system detects hidden defects even in heavily shadowed, complex assemblies, making it an indispensable tool for modern electronics production.

For visitors of the neighboring Semicon trade fair, who focus on applications in the semiconductor industry and device inspection, we also offer tailored solutions. Our inspection systems are ideally suited for the precise examination of semiconductor components as well as the inspection of IC packages and PCBs in critical manufacturing processes. Examples such as the iS6059 and iX7059 demonstrate how our advanced 3D inspection and X-ray solutions ensure quality and reliability in semiconductor manufacturing.

In addition to these two systems, visitors will have the opportunity to explore a wide range of award-winning inspection solutions, including 3D-AOI, 3D Xray inspection, 3D solder paste inspection, conformal coating inspection, and 3D wire bond inspection. Also noteworthy are our latest AI solutions, vAI, as
well as updates to our networking, monitoring, and service software, vConnect, and our new online academy, vAcademy.

We warmly invite you to visit us at electronica 2024 in Munich from November 12th to 15th, 2024, and experience firsthand how our cutting-edge technologies are shaping the future of electronics manufacturing.