Available in 2025: Double-Sided Inspection

Redefining PCB Inspection with Viscom’s iS6059 Double-Sided Inspection

Achieve fast and accurate inspection from both above and below. Designed to set a new standard in quality control, the iS6059 Double-Sided Inspection system combines innovative 3D camera technology to precisely inspect THT solder joints, press-fit, and SMD components on both sides of the PCB without shadows. This advanced system performs high-speed inspections in 2D, 2.5D, and 3D.

The iS6059 Double-Sided Inspection system is equipped with two advanced sensor heads, each mounted on separate axes, to capture images on both the top and bottom sides. The purpose: Due to the high currents involved in applications like electronic vehicles, charging infrastructure, or renewable energy, through-hole mounting remains widely used in these areas.

It is essential to not only check the top side but also the bottom side for issues such as missing pins, unsoldered pins, incomplete solder volume, or pins that are too short. Features like pin  lengths can be accurately measured and documented in profiles.

In addition to its robust inspection features, the iS6059 offers adaptable lighting options to maintain consistent, high-quality image capture in any inspection environment. This adaptability ensures that manufacturers can easily customize the system for specific inspection requirements, achieving optimal defect detection rates and efficient production processes.

For more information: info@viscom.de