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electronica 2024
11/12/2024 - 11/15/2024
Messe München
Munich
Germany
electronica—world's leading trade fair and conference for electronics
The entire electronics industry meets in one place: meet exhibitors in Munich from almost all sub-sectors of the electronics industry, from at least 50 countries around the world.
Axel Klapproth
Viscom AG Senior Technical Manager - Customer Care Team S2
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
Axel.Klapproth@viscom.de +49 511 94996-697
Michael Hofmann
Viscom AG Project Manager - Customer Care Team S1
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
Michael.Hofmann@viscom.de +49 511 94996-651
Premium: iS6059 PCB Inspection Plus
Enhanced 3D image quality and repeatability, thanks to 3D hardware acceleration. Character recognition of even taller components, made possible by greater orthogonal depth of field. Inspection devices are intelligently networked to improve machine communication. With its new XMplus-II camera technology and easy programmability, this innovative system from Viscom sets new standards in premium 3D AOI inspection. XMplus-II camera module 1 orthogonal and 8 inclined cameras Resolution: 20.4 µm/pixel…
Top- and Bottom-Side: iS6059 Double-Sided Inspection
Innovative iS6059 Double-Sided Inspection Highly effective inspection of PCB top and bottom sides to provide the most accurate inspection of components, solder joints and pin lengths using the most advanced 3D camera technology. 1 orth. and 8 angled cameras from above 1 orth. and 8 angled cameras from below Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
Steven Shen
Viscom Machine Vision Trading Co. Ltd. Sales Manager
2nd floor, Block D No. 1010 Kaixuan Road 200052 Shanghai Greater China
steven.shen@viscom.cn +86 13162730436
Ricardo Llinás
Importadora Poirot S.A. Product and Service Manager <p>Argentina, Bolivia, Chile, Colombia, Ecuador, French Guyana, Guyana, Paraguay, Peru, Uruguay</p>
Paseo Bulnes 205 Santiago Chile
ricardo.llinas@poirot.cl +56 2 26884466
High Volume: iS6059 SPI
High-throughput 3D solder paste inspection with the most advanced sensors for shadow-free results and super-easy verification. 1 orth. and 4 angled cameras Resolution: 12 µm/pixel FOV: 58 x 58 mm Single-track transport system For: Solder paste inspection
Axel Wolff
Viscom AG Sales Europe <p>Your Viscom contact partner in Germany for postal code areas 10-34, 37-49, 58-59</p>
Carl-Buderus-Str. 9-15 30455 Hannover Germany
axel.wolff@viscom.de +49 511 94996-342 +49 160 96533937 +49 511 94996-900