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SMTA International 2024
10/22/2024 - 10/24/2024
Donald E. Stephens Convention Center
Illinois, Indiana
USA
Connect. Learn. Advance. - connect with your manufacturing community and colleagues at SMTA International. Learn about research and solutions across electronics manufacturing markets including advanced design and manufacturing industries. Advance your career, your company, and the industry through your participation.
Battery Show Europe 2024
06/18/2024 - 06/20/2024
Messe Stuttgart
Booth: 9-C75
Stuttgart
Germany
Meet manufacturers, suppliers, engineers, thought leaders and purchasers for a conference and trade fair focused on the latest developments in the advanced battery and automotive industries.
SMTA Mexico 2024
09/11/2024 - 09/12/2024
Expo Guadalajara Salón Jalisco Hall D & E
Guadalajara
Mexico
The SMTA Expo & Tech Forum platform brings professionals within the industry together and provides attendees with exposure to global technology at a local level. In addition, the local expos provide an opportunity to educate local engineers who may not be able to attend an SMTA Expo.
SMTconnect 2024
06/11/2024 - 06/13/2024
Nuremberg exhibition grounds
Booth: 4A-145
Nuremberg
Germany
See for yourself Viscom's unique and versatile range of state-of-the-art systems for PCB inspection at the SMTconnect 2024 international trade fair. Familiarise yourself with technologies for solder paste inspection, SMD and solder joint inspection, reliable detection of voids, wire bonds inspection and conformal coatinginspection.
Semicon Taiwan 2024
09/04/2024 - 09/06/2024
Taipei Nangang Exhibition Center
Taipei
Taiwan
Semicon Taiwan is an international trade fair for semiconductor technology and the most important trade event for the micro- and nanoelectronics industry in Taiwan. Topics include technologies for the development and manufacture of semiconductors, solar cells and other micro- and nanoelectronic products.
High Volume: iS6059 PCB Inspection
Efficient iS6059 PCB Inspection The iS6059 PCB Inspection combines precise fault detection with high inspection speed for mass production. Other benefits: Fast programming, intuitive operation, and Industry 4.0 integration. XMs-II / XM8-II 1 orth and 8 angled cameras Resolution: 10 µm/pixel / 8 µm/pixel FOV: 50 x 50 mm / 40 x 40 mm For: assembly inspection, component control, solder joint inspection
Bottom-side: iS6059 THT Inspection
Advanced iS6059 THT Inspection Specifically designed for rapid inspection of PCB undersides to provide the most accurate inspection of THT solder joints and pin lengths using the most advanced 3D camera technology. Extra plus: flexible handling of workpiece carriers. 1 orth and 8 angled cameras Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
productronica India 2024
09/18/2024 - 09/20/2024
BIEC
Delhi
India
International Trade Fair for Electronics Development and Production
productronica India showcases the entire value chain in electronics production in all industrial sectors. The fair has been one of the most important events in Asia since 2000.