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electronica 2024
11/12/2024 - 11/15/2024
Messe München
Munich
Germany
electronica—world's leading trade fair and conference for electronics
The entire electronics industry meets in one place: meet exhibitors in Munich from almost all sub-sectors of the electronics industry, from at least 50 countries around the world.
Premium: iS6059 PCB Inspection Plus
Enhanced 3D image quality and repeatability, thanks to 3D hardware acceleration. Character recognition of even taller components, made possible by greater orthogonal depth of field. Inspection devices are intelligently networked to improve machine communication. With its new XMplus-II camera technology and easy programmability, this innovative system from Viscom sets new standards in premium 3D AOI inspection. XMplus-II camera module 1 orthogonal and 8 inclined cameras Resolution: 20.4 µm/pixel…
Top- and Bottom-Side: iS6059 Double-Sided Inspection
Innovative iS6059 Double-Sided Inspection Highly effective inspection of PCB top and bottom sides to provide the most accurate inspection of components, solder joints and pin lengths using the most advanced 3D camera technology. 1 orth. and 8 angled cameras from above 1 orth. and 8 angled cameras from below Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
High Volume: iS6059 SPI
High-throughput 3D solder paste inspection with the most advanced sensors for shadow-free results and super-easy verification. 1 orth. and 4 angled cameras Resolution: 12 µm/pixel FOV: 58 x 58 mm Single-track transport system For: Solder paste inspection