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S6053BO-V
Automatic optical wire bond inspection with configurable transport. Best inline technology for maximum performance - compatible with all Viscom bond camera modules. Particularly precise with height information thanks to 3D technology for thick-wire and thin-wire control. For: Wire bond inspection, semiconductor, package substrates
PCIM Europe 2024
06/11/2024 - 06/13/2024
Nuremberg exhibition grounds
Booth: 6-437
Nuremberg
Germany
The PCIM Europe is the world's leading exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management.