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Multitalent X8011-III
The flexible manual X-ray system is used for materials examination and solder joint inspection of high-end electronics. The X8011-III offers outstanding image quality, user-friendly operation, and fast programming. For: Solder joint inspection, THT selective solder inspection, void inspection surface soldering, 3D computed tomography, final inspection of equipment
iX7059 Module Inspection
Fully automated 3D X-ray inspection with integrated computed tomography for quality assurance of power semiconductors. For: THT assembly and selective solder joints, hidden blow holes (voids) in surface soldering