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High Volume: iS6059 PCB Inspection
Efficient iS6059 PCB Inspection The iS6059 PCB Inspection combines precise fault detection with high inspection speed for mass production. Other benefits: Fast programming, intuitive operation, and Industry 4.0 integration. XMs-II / XM8-II 1 orth and 8 angled cameras Resolution: 10 µm/pixel / 8 µm/pixel FOV: 50 x 50 mm / 40 x 40 mm For: assembly inspection, component control, solder joint inspection
Bottom-side: iS6059 THT Inspection
Advanced iS6059 THT Inspection Specifically designed for rapid inspection of PCB undersides to provide the most accurate inspection of THT solder joints and pin lengths using the most advanced 3D camera technology. Extra plus: flexible handling of workpiece carriers. 1 orth and 8 angled cameras Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection