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iX7059 PCB Inspection
The new 3D X-ray generation for highly accurate and fast inline inspection of printed circuit boards with a unique, dynamic image acquisition approach. Inspection objects up to 15 kg Rapid inspectioning speed and extremely fast handling For: Solder joint inspection, THT assembly and selective solder joints, void inspection surface soldering, LEDs, server boards, 3D computer tomography
iX7059 Heavy Duty Inspection
The new 3D X-ray generation for highly accurate and fast inspection of large assemblies, such as high-voltage electronics and power electronics. Inspection objects up to 40 kg Handling of workpiece carriers and soldering frames For: Solder joint inspection, THT assemly and selective solder joints, void inspection glue joints, high voltage electronics, 3D computer tomography