109 results

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Viscom: iXCell

Metrology Certifications      MSA 1 Cgk > 1.33 for 1000μm criteria tolerances  MSA 3 GRR < 10 % GRR <10 % on average, <15% on max value, for 1000μm…

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iS6052 CCI

Camera technology XMe CCI  XMe CCI Extended  8M-II-105 mm Angled view cameras       Number of megapixel cameras   4 8 Orthogonal camera       …

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iS6052 PCB Inspection

Camera technology XMe XMs-II XMplus-II 3D sensor technology       Z-resolution 0,5 µm 0,5 µm 0,5 µm Z-range Up to 30 mm Up to 30 mm Up to 30 mm Angled view cameras  …

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Events

Discover our innovations firsthand Events Events

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Business divisions (CCU)

The right Inspection Solutions for your Production Every manufacturing process has its own challenges. That is why Viscom’s Customer Care Units bring together specialized industry expertise and…

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Void Inspection

Void Detection for Reliable Quality Control Advanced void inspection detects internal gaps and irregularities that can affect product integrity. X-ray inspection by Viscom enables precise,…

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Wire Bond Inspection

Ensuring Precision in Wire Bond Inspection Advanced 3D Wire Bond Inspection solutions from Viscom enable the reliable detection of defects in fine-pitch and high-power applications, ensuring precise…

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Solder Paste Inspection

Solder Paste Inspection for Reliable SMT Production Solder Paste Inspection (SPI) by Viscom uses advanced 3D measurement technology to verify solder paste volume, alignment, and print quality on…

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BGA / QFN Inspection

Innovative X-ray Inspection for BGA and QFN Components Viscom’s X-ray inspection detects hidden solder joint defects in BGA (Ball Grid Array) and QFN (Quad Flat No-Lead) Components, including voids,…

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vSPC DataVision

vSPC DataVision Get in touch  Download brochure Software Software vSPC DataVision What is vSPC DataVision? vSPC DataVision is a web-based software solution based on…