The iX7059 Product Family
With the iX7059 product family from Viscom you have 100% quality control in the process line – even with increasing requirements. The innovative and intelligently networked 3D AXI systems enable fast, fully automated inline X-ray inspection of e.g. complex and very large PCBs or heavy, large and enclosed assemblies and solid inspection objects on workpiece carriers.
- 100% quality assurance
- Handles up to 200 kg and 2 meters in length
- Future-ready inline X-ray
- Fast inspection of heavy electronics
- Space-saving system design
- Also ideal for the final assembly line
- Rapid delivery times
Inspection Images from Viscom’s AXI Systems
Explore a selection of inspection images captured with Viscom’s 3D AXI technology. The gallery demonstrates high-resolution X-ray imaging, reliable defect detection, and precise analysis of hidden solder joints and internal structures. These examples show how advanced AXI inspection supports quality assurance in modern electronics manufacturing, even for complex and densely populated assemblies.
Technical Specifications
| iX7059 Heavy Duty Inspection | |
| X-ray tube | Sealed microfocus X-ray tube |
| High voltage | 130 kV (up to 180 kV optional) |
| Tube current | 300 μA (500 μA) |
| Detector | Flat panel detector type FPD T2 (FPD T3 and T4 optional), 14-bit grayscale depth |
| Resolution | 8 - 30 μm/pixel* |
| 3D image capture mode | Evolution 4 as standard, Evolution 5 and Evolution 6 optional for unique dynamic image recordings |
| X-ray cabinet | Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG) and German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 μSv/h |
| Detector configuration | 1 FPD on xy-table |
| User interface | Viscom vVision/EasyPro |
| Statistical process control | Viscom vSPC/SPC, open interface (optional) |
| Verification station | Viscom vVerify/HARAN |
| Remote diagnosis | Viscom SRC (optional) |
| Programming station | Viscom PST34 (optional) |
| Scope of inspection | |
| Defects | Air inclusions/blow holes (voids) in surface soldering, presence, offset, excessive/insufficient solder, solder bridge, solder balls, solder sputter, soldering defects, THT fill level and pin height, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted lead, billboarding, supine, twist, wick-up effect (optional) |
| Operating system | Windows® |
| Processor | Intel®Core™i7 |
| Inspection object size | Up to 500 mm x 500 mm (19.6" x 19.6") (L x W)* |
| Inspection object weight | Up to 40 kg (88.2 lbs) |
| Transfer height | 860 - 980 mm ± 20 mm (33.8" - 38.5" ± 0.7") |
| Width adjustment | Via manual adjustment |
| Support area | 50 mm (1.9") |
| Transport clearance | 150 mm (5.9") as standard, more on request |
| Positioning unit | Synchronous linear motor |
| Interfaces | SECS/GEM, SMEMA, IPC Hermes (optional) |
| Power requirements | 400 V (other voltages on request), 3P/N/PE, 8 A, 4 – 6 bar working pressure |
| System dimensions | 1493 mm x 1654 mm x 2207 mm (58.7" x 65.1" x 86.8") (W x H x D) |
| Line integration dimension | +30 mm (1.1") on both sides |
| Weight | 2500 – 3000 kg (5511.5 – 6613.8 lbs)* |
Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.
We make technology safe, reliable and sustainable
Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.
