iS6052 SPI

Your Cost-Effective New 3D inline system

  • Precision 3D paste analysis 
  • Closed loop functions with solder paste printer and pick-and-place machine
  • Intelligent SMT process optimization 

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iS6052 SPI – reliable 3D solder and sinter paste inspection

Introducing the iS6052 SPI, Viscom's solution for inspecting solder paste applications in SMD production with remarkable efficiency and accuracy. Emerging from over forty years of expertise, this 3D inline system meticulously evaluates critical features like volume, height, and shape, alongside surface area, displacement, and smearing. Equipped with innovative sensor technology including an orthogonal camera and four lateral views, it ensures unparalleled inspection quality. Realistic color imaging facilitates swift and precise verification, while the Fast Flow handling system guarantees exceptional throughput by synchronizing assembly input and output. With minimal handling times and reduced mechanical impact, this system optimizes efficiency without compromising performance. Intelligent networking capabilities further bolster process stability and streamline operations within the SMT line.

Color-assisted 3D solder paste volume calculation

3D solder paste volume calculation with grid pattern

User-friendly overviews in vVision

Paste bridge after soldering

Inspection Images from Viscom’s 3D AOI Systems

Explore a selection of inspection images captured with Viscom’s 3D AOI technology. The gallery highlights the high image quality, precise 3D visualization, and reliable detection that support quality assurance in modern industries. These examples demonstrate how advanced inspection enables accurate analysis of components and solder joints, even in challenging applications

Technical Specifications

Camera technology

XMe-SPI
3D Sensor Technology 
Z-resolution0,1 µm
Z-rangeUp to 5 mm
Orthogonal camera 
Resolution12 µm
Field of view58 mm x 58 mm (2.2" x 2.2")
Angled view cameras 
Number of megapixel cameras4
Inspection SpeedUp to 80 cm²/s

Software

 
User interface Viscom vVision 
Statistical process control Viscom vSPC/SPC, open interface (optional) 
Verification station Viscom vVerify 
Remote diagnosis Viscom SRC (optional)
Programming stationViscom PST34 (optional)

Scope of inspection

 
InspectionInspects solder paste deposits (pad sizes of 01005 components) and dispenser paste for surface, height and shape
Defects/defect featuresToo much/too little solder, missing solder, print displacement (X/Y offset), paste smearing
OptionalCoplanarity, open area analysis, OCR, DMC

System computer

 
 Operating system Windows® 
Processor Intel®Core™i7

PCB handling

 
PCB dimensions 508 mm x 508 mm (20" x 20"), Longboard option available for circuit boards up to 720 mm (28.3") in length* 
PCB support Optional 
Transport height 900 – 950 mm ± 20 mm (35.4" – 37.4" ± 0.7") 
Width adjustment Automatic 
Transport concept Single-track transport system, dual-lane option available 
PCB clamping Pneumatic 
Upper transport clearance 50 mm (1.9") 
Lower transport clearance 50 mm (1.9"); 40 mm (1.5") with PCB support

Other system data

 
Positioning unit Synchronous linear motor 
Interfaces SMEMA, Hermes 
Power requirements 230/400 V, 50 Hz, 3P/N/PE +/- 10%; 4 – 6 bar working pressure 
System dimensions  997 mm x 1756 mm x 1753 mm (39.2" x 69.1" x 69") (W x D x H)
Weight Approx. 820 – 920 kg (1807.7 – 2028.2 lbs)

Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.

We make technology safe, reliable and sustainable

Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.

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