iX7059 One

Lab-to-Fab 3D X-ray Inspection System

  • Resolution down to 1 μm
  • Detects voids/cracks early in manufacturing process
  • Can be used for both standalone and 100% inline applications

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  1. Viscom
  2. Solutions
  3. Product overview
  4. Automated X-ray inspection (AXI)
  5. iX7059 One

iX7059 One – The ONE ideal inspection system for your advanced assembly, power module and semiconductor production.

In the pursuit of excellence, precision is non-negotiable. With the iX7059 One, precision is not just a goal; it is a guarantee. Equipped with state-of-the-art imaging capabilities, this system delivers unrivaled image quality down to an astonishing 1μm resolution. From intricate semiconductor devices to complex leadframe applications, every detail is captured with breathtaking clarity.

But precision extends beyond mere image quality. Its about the ability to identify and address defects with unwavering accuracy. Here, the iX7059 One shines brightest, boasting a greater depth of field that sets a new benchmark in defect detection. Whether it is a subtle flaw or a glaring imperfection, rest assured that nothing escapes the meticulous gaze of this advanced inspection system.

What sets the iX7059 One apart is its versatility. With X-ray inspection capabilities spanning 2D, 2.5D, and 3D, it is equipped to handle the diverse needs of modern manufacturing. From single semiconductor devices with intricate internal structures to leadframe applications requiring comprehensive analysis, this system delivers flexibility from standalone to unparalleled 100 % inline inspection for production performance across the board.

It's a test image of the product Viscom iX7059 one which reflects the high resolution.

Magnified view of the same test object, highlighting the increased level of detail provided by the high-resolution imaging system.

Highly magnified image of the same test object, revealing fine structural details made visible by the system's high-resolution capability.

Inspection Images from Viscom’s AXI Systems

Explore a selection of inspection images captured with Viscom’s 3D AXI technology. The gallery demonstrates high-resolution X-ray imaging, reliable defect detection, and precise analysis of hidden solder joints and internal structures. These examples show how advanced AXI inspection supports quality assurance in modern electronics manufacturing, even for complex and densely populated assemblies.

Technical Specifications

 iX7059 One LeadframeiX7059 One CarrieriX7059 One
X-ray tubeSealed microfocus X-ray tubeSealed microfocus X-ray tubeSealed microfocus X-ray tube
High voltage110kv110kv110kv
Tube currentup to 200 μAup to 200 μAup to 200 μA
DetectorFPD T3 (T4 optional), 14-bit grayscale depthFPD T3 (T4 optional), 14-bit grayscale depthFPD T3 (T4 optional), 14-bit grayscale depth
Resolution1 - 25 μm/pixel1 - 25 μm/pixel1 - 25 μm/pixel
3D image capture modeEvolution 5 as standard, Evolution 6 optionalEvolution 5 as standard, Evolution 6 optionalEvolution 5 as standard, Evolution 6 optional
X-ray cabinetDesigned to meet requirements for fully protected devices in accordance with the
German Radiation Protection Act (StrlSchG) and the German Radiation Protection
Ordinance (StrlSchV). Radiation leakage rate < 1 μSv/h		Designed to meet requirements for fully protected devices in accordance with the
German Radiation Protection Act (StrlSchG) and the German Radiation Protection
Ordinance (StrlSchV). Radiation leakage rate < 1 μSv/h		Designed to meet requirements for fully protected devices in accordance with the
German Radiation Protection Act (StrlSchG) and the German Radiation Protection
Ordinance (StrlSchV). Radiation leakage rate < 1 μSv/h

Software

 
User interfaceViscom vVision
Statistical process control Viscom vSPC/SPC, open interface (optional)
Verification station Viscom vVerify
Remote diagnosis Viscom SRC (optional)
Programming station Viscom PST34 (optional)

Scope of inspection

 
InspectionSolder bump inspection, microcracks, void analyses, leadframe inspection, solder layer quality, cold solder joints, solder joint morphology, HiP for solder bumps, wirebond defects, advanced packaging applications

System computer

 
Operating systemWindows® 
ProcessorIntel®Core™i7
 iX7059 One LeadframeiX7059 One CarrieriX7059 One
Product dimensionsUp to 300 mm x 550 mm
(11.8" x 21.6") (L x W)*		Up to 500 mm x 500 mm
(19.6" x 19.6") (L x W)*		Up to 500 mm x 500 mm
(19.6” x 19.6”) (L x W)*
Product weightUp to 5 kg (11 lbs)Up to 5 kg (11 lbs)Up to 5 kg (11 lbs)
Clamping thickness0 - 2.5 mm**5.5 - 11 mm**2.5 - 5.5 mm**
Transfer height860 - 980 mm ± 20 mm (33.8" - 38.5" ± 0.7")860 - 980 mm ± 20 mm (33.8" - 38.5" ± 0.7")860 - 980 mm ± 20 mm (33.8" - 38.5" ± 0.7")
Width adjustmentAutomatic during setupAutomatic during setupAutomatic during setup
ClampingPneumaticPneumaticPneumatic
Support area3 mm (0.1")3 mm (0.1")3 mm (0.1")
Upper transport clearance2 - 50 mm (0.07 - 1.9")2 - 50 mm (0.07 - 1.9")2 - 50 mm (0.07 - 1.9")
Lower transport clearance50 mm (1.9")50 mm (1.9")50 mm (1.9")

Other system data

 
Positioning unitSynchron-Linearmotor
InterfacesSECS/GEM, SMEMA, IPC Hermes (optional)
Power requirements 400 V (other voltages on request), 3P/N/PE, 8 A, 4 – 6 bar working pressure
System dimensions 1493 mm x 1654 mm x 2207 mm (58.7" x 65.1" x 86.8") (W x H x D)
Line integration dimension+30 mm (1.1") on both sides
Weight2255 kg (4971.4 lbs)*

Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.

We make technology safe, reliable and sustainable

Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.

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