EMS & High-Mix-Low-Volume

Smart Quality Control. Ready for Every Production Change.

Viscom supports EMS manufacturers with flexible inspection technology designed for high product variety and frequent production changes. Automated inline and offline inspection helps streamline changeovers, detect defects early, and keep dynamic manufacturing processes running efficiently.

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EMS / High-Mix Low-Volume

Flexible Inspection for High-Mix Manufacturing

In EMS and High Mix Low Volume manufacturing environments, flexibility, quality, and fast changeovers are critical to maintaining competitiveness. Frequent product changes, small batch sizes, and high product variation create increasing demands on quality assurance and process control. Our inspection systems provide reliable partially automated and fully automated inline and offline inspection capabilities, enabling manufacturers to detect defects early, reduce scrap, and minimize rework. By automating inspection processes, EMS providers improve product quality, increase operational efficiency, and maintain stable production performance even for complex assemblies and dynamic manufacturing schedules.

Viscom’s inspection solutions are specifically designed to meet the challenges of High Mix Low Volume production and support electronics manufacturers in achieving greater visibility, consistency and manufacturing efficiency. With high-precision defect detection, rapid adaptation to new product variants, and seamless integration into existing production lines, our systems create the foundation for scalable quality management. From incoming goods inspection and SMT production lines to final quality control, advanced inspection technology helps increase first-pass yield, optimize throughput, and strengthen long-term competitiveness in EMS manufacturing. 

High-Mix Low-Volume Manufacturing Solutions

From EMS production and High-Mix Low-Volume manufacturing to complex electronic assemblies and rapid product changeovers, Viscom’s inspection solutions ensure outstanding quality throughout the entire production process. Our advanced inspection technologies help manufacturers increase process reliability, reduce defects, maximize first-pass yield, and achieve greater efficiency in dynamic manufacturing environments.

EMS & SMT Production

We inspect electronic assemblies for solder defects, missing or misaligned components, polarity errors, insufficient solder joints, and overall assembly quality. AOI and X-ray inspection ensure stable production, outstanding product quality, and maximum process efficiency.

High-Mix Low-Volume Manufacturing

We inspect a wide range of product variants with fast changeovers, high-precision detection, and flexible inspection programs. Automated inspection solutions ensure consistent quality, reduced scrap, minimized rework, and reliable manufacturing performance.

Inline & Offline Quality Inspection

We inspect electronic assemblies from incoming goods inspection through SMT production to final quality control. Advanced AOI and X-ray technologies improve process transparency, optimize throughput, and provide the foundation for scalable quality management in EMS manufacturing.

Why choose Viscom?

We make technology safe, reliable and sustainable!

40 Years of Expertise

Four decades of inspection know-how, combining deep industry knowledge with proven innovation to deliver trusted inspection solutions.

100% Defect Detection

Always advancing with the latest inspection solutions to achieve the highest detection rates and support zero-defect manufacturing.

Award-Winning Inspection Solutions

Industry-leading inspection systems recognized worldwide for outstanding performance, precision, and reliability across every production stage.

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FIND THE RIGHT INSPECTION SOLUTION FOR YOUR Manufacturing process

Benefit from Viscom's award-winning inspection technologies and our global support from experts.

Applications

Void Inspection

Advanced inspection solutions from Viscom enable the reliable detection of internal voids, gaps, and irregularities that can affect product performance and integrity.

 

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BGA and QFN Inspection

Advanced inspection solutions from Viscom enable the reliable detection of hidden defects in BGA and QFN assemblies, ensuring precise quality control where solder joints cannot be visually inspected. 

 

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Solder Paste Inspection

Advanced SPI solutions from Viscom enable the reliable detection of solder paste defects before component placement, ensuring precise control of paste volume, alignment, and deposition. 

 

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ALL applications