40 Years of Expertise
Four decades of inspection know-how, combining deep industry knowledge with proven innovation to deliver trusted inspection solutions.
Individual Inspection Solutions
Find the right solution for your individual inspection needs with our comprehensive portfolio of inspection systems.
Smart Software & AI Solutions
Explore our portfolio of software and AI solutions designed to optimize your inspection processes and turn data into actionable insights.
High-Performance Components
Discover our range of X-ray tubes and components designed to deliver reliable performance for your inspection systems.
Service & Support
Benefit from our comprehensive services and expert support designed to ensure reliable performance and maximize the availability of your inspection solutions.
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About our Company
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Post-Reflow Inspection
Inspection systems by Viscom inspect solder joints and assembly quality after the reflow process. Precise detection of solder defects, bridges, voids, and misalignment ensures reliable PCB (Printed Circuit Board) manufacturing.
Post-Reflow Inspection
Post-Reflow Inspection takes place after soldering and focuses on the quality of solder joints, component placement, and final PCB (Printed Circuit Board) assembly. Viscom’s advanced 3D inspection systems use high-resolution imaging and precise 3D measurement to inspect solder joints and components. Typical defects such as insufficient solder, solder bridges, lifted or misaligned components, missing components, and polarity errors can be detected quickly and reliably.
For hidden solder joints that cannot be inspected optically, AXI (Automated X-ray Inspection) complements AOI (Automated Optical Inspection) by providing detailed insight beneath components such as BGAs, QFNs, and LGAs. X-ray inspection enables reliable detection of voids or other hidden solder joint defects. Combining 3D AOI and AXI provides comprehensive post-reflow quality control, helping manufacturers improve first-pass yield, reduce rework, optimize SMT processes, and ensure reliable PCB assemblies.
We make technology safe, reliable and sustainable!
Four decades of inspection know-how, combining deep industry knowledge with proven innovation to deliver trusted inspection solutions.
Always advancing with the latest inspection solutions to achieve the highest detection rates and support zero-defect manufacturing.
Industry-leading inspection systems recognized worldwide for outstanding performance, precision, and reliability across every production stage.
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Benefit from Viscom's award-winning inspection technologies and our global support from experts.
With innovative 3D camera technology, the iS6059 THT Inspection 3D AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and at high precision on the underside of the PCB.
The iS6059 PCB Inspection combines the advantages of special high-speed 3D camera technology with excellent inspection quality and extremely fast inspection speed.
The iS6059 Dual Lane Variants Inspection combines the advantages of special high-speed 3D sensor technology with excellent inspection quality and extremely fast inspection speed.