Battery Cell Inspection is essential for ensuring the quality, safety, and performance of lithium-ion batteries throughout the manufacturing process. Advanced X-ray inspection enables non-destructive analysis of internal cell structures, helping manufacturers detect defects early and optimize production efficiency. 

Our subsidiary Exacom provides advanced X-ray inspection and metrology systems for battery cell manufacturing, supporting coin cells, stacked cells, cylindrical cells, and prismatic cells. 

Designed for gigafactory-scale production, the inspection systems help manufacturers improve production yield, reduce scrap rates, and ensure the highest quality and safety standards. By delivering precise real-time inspection data, potential process issues can be detected early, minimizing costs and maximizing productivity. 

Beyond standard Good / No-Good inspections and AC-overhang checks, Exacom’s technology provides detailed process insights and real-time feedback on critical manufacturing parameters, enabling true process optimization and continuous quality improvement. 

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With its iX7059 product line, Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards. Outstanding inspection performance for SMD and THT solder joints as well as exact measurement of voids deliver 100% quality assurance in modern SMT production, so that hidden defects can be detected even when complex assemblies cause massive shadowing effects. In addition to traditional SMD inspection, the compact iX7059 PCB Inspection or iX7059 PCB Inspection XL 3D AXI system also provides high-precision, reliable inspection of soldering defects such as head-in-pillow and pores in BGA and LGA components. Cutting-edge, powerful microfocus X-ray technology, new dynamic 3D image acquisition methods and seamless handling guarantee the best throughput rates. The iX7059 PCB Inspection XL with extended longboard option comes into play for especially large PCB assemblies measuring up to 1,400 mm – this solution is ideal for server boards, LEDs, semiconductors and 5G electronics.

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The semiconductor and electronics industry rely on advanced inspection technologies to ensure the highest standards of quality, reliability, and performance. From wafer fabrication to advanced packaging, precise inspection is essential to detect defects such as cracks, voids, contamination, and misalignment at an early stage. This includes wafer and die level inspection as well as the analysis of interconnects like microvias, and TSVs, enabling manufacturers to optimize yield and maintain process stability in increasingly complex production environments. 

With the rapid evolution of advanced packaging, inspection plays a critical role in ensuring the integrity of solder balls, bumps, pads, and various bonding technologies such as wire bonding, flip-chip, hybrid, and direct bonding. In addition, 3D inspection of internal package structures and wafer-level process monitoring are key to guaranteeing performance and long-term reliability in high-density and high-performance applications. 

In power electronics and advanced material processing, inspection is equally vital to ensure durability and efficiency. This includes the evaluation of DCB, AMB, and ceramic substrates, as well as sintered and soldered interfaces and bond integrity within power modules. Furthermore, Viscom’s inspection solutions enable precise analysis of advanced materials such as sinter, gold, and silver pastes, supporting accurate volume control, homogeneity, and stable manufacturing processes across a wide range of industrial application. 

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