Industrial Electronics
Detect Hidden Defects with Confidence
In Industrial Electronics, quality and reliability are essential for ensuring the safe and dependable performance of electronic assemblies. Viscom’s X-ray systems enable precise, non-destructive inspection of complex industrial electronics – from Printed Circuit Boards (PCBs) and power electronics to control and sensor modules, power supplies, and electronic assemblies. High-resolution X-ray images reveal hidden defects, voids, faulty solder joints, loose components, and component misalignment.
Especially for complex assemblies and components with hidden structures, Viscom’s X-ray inspection solutions deliver reliable and reproducible inspection results. This enables defects to be detected at an early stage, reduces scrap, and helps ensure consistently high product quality.
Why choose Viscom?
We make technology safe, reliable and sustainable!
40 Years of Expertise
Four decades of inspection know-how, combining deep industry knowledge with proven innovation to deliver trusted inspection solutions.
100% Defect Detection
Always advancing with the latest inspection solutions to achieve the highest detection rates and support zero-defect manufacturing.
Award-Winning Inspection Solutions
Industry-leading inspection systems recognized worldwide for outstanding performance, precision, and reliability across every production stage.
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FIND THE RIGHT INSPECTION SOLUTION FOR YOUR Manufacturing process
Benefit from Viscom's award-winning inspection technologies and our global support from experts.
Applications
THT
Advanced 3D AOI solutions from Viscom enable the reliable inspection of THT components, solder joints, and press-fit connections, even in complex PCB assemblies.
Device Inspection
Device Inspection is a critical application in modern manufacturing, enabling the non-destructive testing of electronic devices, components, and assemblies using advanced 3D Inline X-ray inspection technology.
Post-Reflow Inspection
Post-Reflow Inspection takes place after soldering and focuses on the quality of solder joints, component placement, and final PCB (Printed Circuit Board) assembly.