iS6059 Wire Bond Inspection – High-Performance Automatic 2D & 3D Wire Bond Inspection

With the iS6059 Wire Bond Inspection system, Viscom offers the best inline technology and top performance for the automatic optical inspection of wire bonds. Where high throughput is a must, dual-track operations can significantly cut inspection times. The system is particularly easy to configure beyond standard specifications to meet customer-specific needs. Even large inspection objects can then be inspected safely and effectively.

The high-precision inspection in 2D and/or 3D guarantees reliable defect detection for ribbon, die, ball-wedge, wedge-wedge, and security bonds as well as ribbons. The inspection scope can be customized beyond standard defects for additional applications. Damage and misplaced components are also reliably detected. The powerful Viscom inspection software performs combined inspection of wire bonds and SMD assembly. A high-resolution camera captures all bond positions and wires. The inspection scope includes wire paths, dies, and component positions. It does not matter whether the connections are made of copper, aluminum, or gold, or whether they are ribbon, thick wire, or thin wire.

With Viscom's powerful SPC evaluation, numerous conclusions regarding the process can be made. As a result, defect causes are reduced to increase production quality. Remote diagnosis, worldwide maintenance and a Service hotline complete the offer.