Inspection Images from Viscom’s 3D AOI Systems
Explore a selection of inspection images captured with Viscom’s 3D AOI technology. The gallery highlights the high image quality, precise 3D visualization, and reliable detection that support quality assurance in modern industries. These examples demonstrate how advanced inspection enables accurate analysis of components and solder joints, even in challenging applications.
Technical Specifications
Camera technology | XMs-II | XM8-II | XMplus-II | XM-SPI-II |
| 3D sensor technology | ||||
| Z-resolution | 0.5 µm | 0.5 µm | 0.5 µm | 0.1 µm |
| Z-range | Up to 30 mm (1.1") | Up to 30 mm (1.1") | Up to 30 mm (1.1") | Up to 5 mm (0.1") |
| Angled view cameras | ||||
| Number of megapixel cameras | 8 | 8 | 8 | 4 |
| Orthogonal camera | ||||
| Resolution | 10 µm | 8 µm | 10 µm | 12 µm |
| Field of view | 50 mm x 50 mm (1.9" x 1.9") | 40 mm x 40 mm (1.5" x 1.5") | 50 mm x 50 mm (1.9" x 1.9") | 58 mm x 58 mm (2.2" x 2.2") |
| Inspection speed | Up to 65 cm2 /s | Up to 50 cm2 /s | Up to 70 cm2 /s | Up to 80 cm2 /s |
Software | |
| User interface | Viscom vVision, SI on request |
| Statistical process control | Viscom vSPC/SPC, open interface (optional) |
| Verification station | Viscom vVerify/HARAN |
| Remote diagnosis | Viscom SRC (optional) |
| Programming station | Viscom PST34 (optional) |
Scope of inspection | |
| Components | Up to 03015 and fine-pitch components |
| Inspection | Solder paste, solder joint and assembly control |
| Defects/defect features | Excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape |
| Optional | Free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter |
System computer | |
| Operating system | Windows® |
| Processor | Intel®Core™i9 |
PCB handling | |
| PCB dimensions | 450 mm x 350 mm (17.7" x 13.7"), minimum width 70 mm (2.7"), Longboard option available for circuit boards up to 720 mm (28.3") in length* |
| Transport height | 850 - 950 mm ± 20 mm (33.4" - 37.4" ± 0.7") |
| Width adjustment | Automatic |
| Transport concept | Dual-track transport system |
| PCB clamping | Pneumatic |
| Upper transport clearance | 50 mm (1.9") |
| Lower transport clearance | 50 mm (1.9") |
Other system data | |
| Positioning unit | Synchronous linear motor |
| Interfaces | SMEMA \ Hermes \ third-party providers |
| Power requirements | 230/400 V, 50/60 Hz, 3P/N/PE +/- 10%; 4 – 6 bar working pressure |
| System dimensions | 1100 mm x 2006 mm x 1753 mm (43.3" x 78.9" x 69") (W x D x H) |
| Weight | Approx. 1085 – 1195 kg (2392 – 2634.5 lbs) |
Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.
We make technology safe, reliable and sustainable
Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.
