- Two inspection concepts in one system: Viscom XMC and Viscom SI
- Inspection of large and heavy components weighing up to 15 kg
- Reliable, robust inspection with outstanding cycle times
- Ideal for high-mix, low-volume manufacturing environments
- Intuitive and convenient system operation
- Fast and easy inspection program creation
- High resolution and exceptional image quality
- Premium-quality system components for maximum reliability
- The leading solution for in-line and off-line X-ray inspection
Inspection Images from Viscom’s MXI Systems
Explore a selection of inspection images captured with Viscom’s MXI technology. The gallery showcases high-resolution X-ray imaging, revealing hidden structures, internal defects, and dimensional deviations with exceptional clarity. These examples demonstrate how advanced non-destructive testing supports reliable quality assurance across a wide range of industrial applications.
Technical Specifications
X-ray technology | X8068 |
| X-ray tube | Open microfocus transmission tube Viscom XT9160 T-ED (other X-ray tubes available upon request) |
| High voltage | 20 - 160 kV |
| Tube current | 5 - 1000 µA |
| Target power | Max. 40 W |
| Geometric magnification | > 2500 times |
| JIMA proven resolution (at 90 kV/80 μA) | < 16 - 50 μm / < 4 μm / < 1.5 μm* |
| Image converter diagonal | 7.3" or 11.0" FPD, 14 Bit |
| X-ray cabinet | Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG), German Radiation Protection Ordinance (StrlSchV), CE mark and additional international standards for worldwide use. Radiation leakage rate < 1 µSv/h |
Software | |
| User interface | Viscom XMC / Viscom SI optional / vVision ready |
| Available software packages* | BGA analysis software QFN analysis software THT analysis software ACA analysis software (surface analysis) Fully automatic Viscom SI analysis software XVR-CT software (planar, rotary) vVerify / HARAN Viscom Quality Uplink to AOI, AXI, and SPI from Viscom for process optimization |
Scope of inspection | |
| Components: | Electronic components and SMT components (BGA, μBGA, flip chips, and assembled circuit boards) |
| Solder joints: | Visible and concealed solder joints |
| Defects/defect features: | Air inclusions/blow holes in the solder joint (voids), presence, offset, too much/insufficient solder, solder bridge, solder splash (optional), soldering error, non-wetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted lead, billboarding, supine, twist, polarity error, wick-up effect (optional), head-in-pillow (balls), THT fill level, and pin height |
System computer | |
| Operating system | Windows® |
| Monitor | High-resolution 24" LCD display for special depiction of grayscale values in the SMT and electronics sectors (DICOM Standard) |
Substrate handling | X8068 |
| Manipulator | 5 axes with sample table |
| Horizontal x/y-axis | Travel range: 720 mm x 1000 mm (28.3" x 39.3") |
| Vertical z-axis | Travel range: 320 mm (12.5") |
| Detector axis | 0° - 60° pivoting |
| Rotational axis | n x 360° |
| Inspection object size | Up to 722 mm (28.4") (diameter) |
| Inspection object weight | Up to 25 kg (55.1 Ibs) |
| Sample change | Motorized window opening |
| Optional additional axes available | Yes |
Other system data | X8068 |
| Power requirements | 230 V (other voltages on request), 1P/N/PE, 16 A |
| System dimensions | 1859 mm x 2202 mm x 2155 mm (73.1" x 86.6" x 84.8") (W x H x D) |
| Weight | < 3200 kg (7054.7 Ibs) |
Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.
We make technology safe, reliable and sustainable
Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.
