iX7059 Device Inspection

High-precision Automatic X-ray Inspection for various Devices

  • Fast and reliable inspection ensuring top product quality
  • Handles devices up to 200 kg and 2 meters in length
  • Customized solutions for every inspection challenge 

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iX7059 Device Inspection – Innovative X-ray inspection for maximum product quality and process efficiency

The iX7059 Device Inspection 3D X-ray system offers an economical and effective solution for the fast and reliable final inspection of a wide range of devices and applications that need to function smoothly in everyday life. Potential applications typically include smartphones, tablets, notebooks and desktop PCs, battery management systems, and cartridges for medical and industrial use. 

Whether used in the production line or as a cellular concept, the system detects hidden defects such as foreign objects that can lead, among other things, to defective soldered and welded joints, short circuits, or missing components that may later affect proper functionality. The iX7059 Device Inspection is robust and easy to maintain, and is designed to operate without restriction for 24 hours a day. Its short cycle times, high inspection depth, and the option for planar CT (3D) ensure adherence to high quality standards while operating at maximum efficiency. 

Networking the iX7059 Device Inspection with other Viscom systems in the production line makes it possible to benefit from the various possibilities of effective process control. Process steps can be statistically monitored and documented with powerful Viscom tools that allow for the intelligent analysis of inspection results. Inspection programs are quick and intuitive to create and optimize, which is a considerable advantage for a variety of situations, such as when you need to change products frequently. 

Foreign material trapped under PCB, missing/surplus fixing materials

Missing material in cartridges

2D AI-based screw detection inside a battery management system

Anode/cathode separation within a granulate with metal particles

Viscom automatic report for screw detection, additional & missing material

The iX7059 Device Inspection 3D X-ray system offers an economical and effective solution for the fast and reliable final inspection of a wide range of devices and applications that need to function smoothly in everyday life. Potential applications typically include smartphones, tablets, notebooks and desktop PCs, battery management systems, and cartridges for medical and industrial use.

  • Handles devices up to 200 kg and 2 meters in length
  • Welding and cavity detection of various materials
  • Seamlessly integrated for streamlined process control
  • Customized solutions for every inspection challenge 

High-resolution 3D X-ray technology reliably detects even the smallest foreign objects, such as screws. Precise 3D imaging reveals faulty assemblies and enables fast and reliable quality control – even for complex assemblies.

Inspection Images from Viscom’s Device Inspection Systems

Explore a selection of inspection images captured with Viscom’s 3D AXI technology. The gallery demonstrates high-resolution X-ray imaging, reliable defect detection, and precise analysis of hidden solder joints and internal structures. These examples show how advanced AXI inspection supports quality assurance in modern electronics manufacturing, even for complex and densely populated assemblies.

Technical Specifications

X-ray technology

iX7059 Device InspectioniX7059 Device Inspection XL
X-ray tubeSealed microfocus X-ray tubeSealed microfocus X-ray tube
High voltage130 kV130 kV (up to 180 kV optional)
Tube current300 µA300 µA (500 µA)
DetectorFlat panel detector type FPD T2 (FPD T3 optional), 14-bit grayscale depthFlat panel detector type FPD T2 (FPD T3 optional), 14-bit grayscale depth
Resolution5 – 39 µm/Pixel5 – 39 µm/Pixel
X-ray cabinetDesigned to meet requirements for fully protected devices in accordance with the German Radiation Protection Act (StrlSchG) and the German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/hDesigned to meet requirements for fully protected devices in accordance with the German Radiation Protection Act (StrlSchG) and the German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h

Scope of inspection

 
InspectionAir inclusions (voids) in soldered and welded joints, presence, offset, foreign material, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, etc.

 

PCB handling

iX7059 Device Inspection iX7059 Device Inspection XL
Inspection object sizeWorkpiece carrier up to 610 mm x 600 mm (24" x 23.6") (L x W)*Workpiece carrier up to Up to 2000 mm (78.7") (L)*
Inspection object weightUp to 10 kg (22 lbs)Up to 200 kg (441 lbs)
Transfer height 860 – 980 mm ± 20 mm (33.9" – 38.6" ± 0.8")The values for the XL version deviate significantly upwards. More details available upon request.
Width adjustmentAutomatic during setupThe values for the XL version deviate significantly upwards. More details available upon request.
ClampingPneumaticThe values for the XL version deviate significantly upwards. More details available upon request.
Support area3 mm (0.1")The values for the XL version deviate significantly upwards. More details available upon request.
Upper transport clearanceUp to 50 mm (2")The values for the XL version deviate significantly upwards. More details available upon request.
Lower transport clearanceUp to 50 mm (2")The values for the XL version deviate significantly upwards. More details available upon request.

Other system data

 
Positioning unitSynchronous linear motor 
InterfacesSMEMA, IPC Hermes (optional) 
Power requirements 400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 6 bar working pressure 
System dimensions 1493 mm x 1654 mm x 2207 mm (58.8" x 65.1" x 86.9") (W x H x D) 
Weight2245 kg (4949 lbs)*

Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.

We make technology safe, reliable and sustainable

Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.

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