iS6059 THT Inspection

Precise THT Inspection from Below with Innovative 3D Sensor Technology

  • Unmatched 3D inspection from below
  • Shadow-free precision with 8 angled cameras
  • Flexible inspection of THT & SMD components 

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iS6059 THT Inspection – unmatched 3D AOI for underside quality control

With innovative 3D camera technology, the iS6059 THT Inspection 3D AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and at high precision on the underside of the printed circuit board. PCBAs as well as inspection objects on workpiece carriers are inspected at high speed in 2D, 2½D and 3D. As a result, the iS6059 THT Inspection stands for maximum defect detection and highest throughput. Different lighting can be used flexibly and so provide inspection results in excellent quality.

Height profiles of THTs

Insufficient wetting (front) and missing pin (back)

Reliable 3D pin length inspection

3D quality control of THT solder joints

Inspection Images from Viscom’s 3D AOI Systems

Explore a selection of inspection images captured with Viscom’s 3D AOI technology. The gallery highlights the high image quality, precise 3D visualization, and reliable detection that support quality assurance in modern industries. These examples demonstrate how advanced inspection enables accurate analysis of components and solder joints, even in challenging applications.

Technical Specifications

Camera technology

XMu-II
3D sensor technology 
Z-resolution0,5 µm
Z-rangeUp to 30 mm (1.1")
Angled view cameras 
Number of megapixel cameras8
Orthogonal camera 
Resolution13 μm
Field of view50 mm x 50 mm

Software

 
User interfaceViscom vVision/SI EasyPro
Statistical process controlViscom vSPC/SPC, open interface (optional)
Verification stationViscom vVerify/HARAN
Remote diagnosisViscom SRC (optional)
Programming stationViscom PST34 (optional) 

Scope of inspection

 
ComponentsTHT, press-fit and SMD
Solder joints3D inspection of PCB bottom sides after wave soldering or selective soldering
Fehler/MerkmaleSMD: Presence, XY position, rotation, component height, polarity, missing solder, soldering defects, lifted heads/tombstoning, bridging
THTPresence, XY position, missing solder, soldering defects, bridging, pin height, non-wetting on pins, non-wetting on pads
OptionalFree area analysis, wobble circle error, color ring analysis, OCR, blow holes in the solder joint, solder ball/solder sputter

System computer

 
Operating systemWindows® 
ProcessorIntel®Core™i9

PCB handling

 
PCB dimensions508 mm x 560 mm (20" x 22"); Longboard option available for circuit boards up to 720 mm (28.3") in length
Transport height850 - 950 mm ± 20 mm (33.4" - 37.4" ± 0.7"); other heights on request
Width adjustmentAutomatic
Transport conceptSingle-track transport system
PCB clampingPneumatic
Upper transport clearanceUp to 100 mm (3.9"); other heights on request
Lower transport clearance60 mm (2.3")

Other system data

 
Positioning unitSynchronous linear motor
InterfacesSMEMA, Hermes, third-party providers
Power requirements400 V, 50 Hz, 3P/N/PE +/- 10%; 4 – 6 bar working pressure
System dimensions1100 mm x 1756 mm x 1753 mm (43.3” x 69.1” x 69”) (W x D x H)
WeightApprox. 935 kg (2061,3 lbs)

Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.

We make technology safe, reliable and sustainable

Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.

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