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S6053BO-V
Automatic optical wire bond inspection with configurable transport. Best inline technology for maximum performance - compatible with all Viscom bond camera modules. Particularly precise with height information thanks to 3D technology for thick-wire and thin-wire control. For: Wire bond inspection, semiconductor, package substrates
iX7059 PCB Inspection
The new 3D X-ray generation for highly accurate and fast inline inspection of printed circuit boards with a unique, dynamic image acquisition approach. Inspection objects up to 15 kg Rapid inspectioning speed and extremely fast handling For: Solder joint inspection, THT assembly and selective solder joints, void inspection surface soldering, LEDs, server boards, 3D computer tomography
iX7059 Heavy Duty Inspection
The new 3D X-ray generation for highly accurate and fast inspection of large assemblies, such as high-voltage electronics and power electronics. Inspection objects up to 40 kg Handling of workpiece carriers and soldering frames For: Solder joint inspection, THT assemly and selective solder joints, void inspection glue joints, high voltage electronics, 3D computer tomography
Multitalent X8011-III
The flexible manual X-ray system is used for materials examination and solder joint inspection of high-end electronics. The X8011-III offers outstanding image quality, user-friendly operation, and fast programming. For: Solder joint inspection, THT selective solder inspection, void inspection surface soldering, 3D computed tomography, final inspection of equipment
Battery cell inspection
The Viscom subsidiary Exacom GmbH develops tailor-made X-ray solutions for high-precision battery inspection. The focus is on rapid image acquisition and handling of different cell types such as coin cells, cylindrical cells and pouch cells. For: Battery cell inspection, energy storage products
iX7059 Module Inspection
Fully automated 3D X-ray inspection with integrated computed tomography for quality assurance of power semiconductors. For: THT assembly and selective solder joints, hidden blow holes (voids) in surface soldering
Microfocus X-ray tubes
Viscom develops and manufactures micro-focus X-ray tubes at the highest level. The product portfolio includes direct beam and transmission tubes with voltages up to 250 kV. In addition to product adaptations such as special mounting holes, Viscom also develops custom-made products. For: Micro-focus X-ray tubes