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iX7059 PCB Inspection – 3D X-ray inspection for high-density and double-sided PCB assemblies at the highest level

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With its iX7059 product line, Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards. Outstanding inspection performance for SMD and THT solder joints as well as exact measurement of voids deliver 100% quality assurance in modern SMT production, so that hidden defects can be detected even when complex assemblies cause massive shadowing effects. In addition to traditional SMD inspection, the compact iX7059 PCB Inspection or iX7059 PCB Inspection XL 3D AXI system also provides high-precision, reliable inspection of soldering defects such as head-in-pillow and pores in BGA and LGA components. Cutting-edge, powerful microfocus X-ray technology, new dynamic 3D image acquisition methods and seamless handling guarantee the best throughput rates. The iX7059 PCB Inspection XL with extended longboard option comes into play for especially large PCB assemblies measuring up to 1,600 mm – this solution is ideal for server boards, LEDs, semiconductors and 5G electronics.

Inspection Scope

  • Seamless, perfect handling of PCB assemblies – even for very large PCBs measuring up to 1,600 mm
  • Powerful X-rays with 130 kV or optionally 160 kV
  • Unbeatably fast dynamic image acquisition concept Evolution 4 or optionally 5 for even more speed and the highest throughput
  • High-precision inspection in 2D, 2.5D and 3D
  • High-quality 3D AXI volume calculation with planar CT
  • Additional vertical slices for optimum analyses and dependable verification
  • Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: transferability to all systems
  • Automated grayscale value calibration for consistent inspection results
  • Traceability, statistical process control, offline programming, multiline verification
  • Viscom Quality Uplink: effective networking and process optimization
  • Interfaces: SMEMA, IPC Hermes Standard (optional)
Scope of inspection: Air inclusions/blow holes (voids) in surface soldering, presence, offset, excessive/insufficient solder, solder bridge, solder balls, solder sputter, soldering defects, THT fill level and pin height, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted lead, billboarding, supine, twist, wick-up effect (optional)
System housing: 1,493 mm x 1,654 mm x 2,207 mm (W x H x D)
X-ray tube: Sealed microfocus X-ray tube
High voltage: 130 kV (up to 180 kV optional)
Detector: Flat panel detectors type FPD T2
(T3 optional), 14-bit grayscale value depth
Resolution: 8.5 – 25 µm/pixel
Inspection procedure: 2D, 2.5D, 3D  
  iX7059 PCB Inspection iX7059 PCB Inspection XL
Inspection object dimensions: up to 610 x 600 mm* (L x W) up to 1,600 x 660 mm* (L x W)
Inspection object weight: up to 10 kg up to 15 kg
User interface: Viscom vVision/EasyPro  
*Depending on configuration    

Advantages at a glance

  • Optimal FPY results in SMT production
  • Future-ready 3D inline X-ray with CT
  • Inspection even for large PCB assemblies
  • Best defect coverage for zero defect strategy
  • Space-saving system design
  • Extremely simple programming



iX7059 PCB Inspection XL

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