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AXI BondAOI Bond

Efficient AOI and AXI inspection for perfect bonds

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AXI BondAOI Bond
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Quick, Precise Inspection – X7065-II BO for Bonding Wires

Viscom’s new bond inspection system offers an ideal solution for the increasing demand for X-ray inspection in the bond area. The X7056-II BO is ideal for installation in final assembly for power electronics, circuits, sensor construction and packaging to ensure 100% quality control. The inline system effectively combines optical wire bond control with X-ray inspection. Working on this basis, the unique X7056-II BO combined system ensures comprehensive inspection of power semiconductors and encapsulated sensor elements alike. The high-resolution camera system ensures absolutely reliable inspection of all bond sites and wires, and open and concealed connection points. Enclosed wire bonds and concealed solder joints underneath chips are also reliably inspected. The combined AOI and AXI bond inspection ensures extremely fast cycle times at maximum inspection depth.

Inspection scope

  • Can be used as a 3D AXI system or a combined 3D AXI / 3D AOI system
  • Ideal for previously sealed circuits with thin wire bonds
  • Outstanding solder joint inspection on power semiconductors
  • High-precision inspection of single or double-sided electronic assemblies
  • Maximum inspection program optimization through integrated verification
  • Additional vertical slices for optimum analyses and dependable verification
  • High-quality 3D AXI volume calculation with planar CT
  • Global libraries, global calibration: transferability to all systems
  • Automated grayscale value calibration for consistent inspection results
  • Traceability, statistical process control, offline programming, multiline verification
  • Viscom Quality Uplink: effective networking and process optimization

Optional:

  • Freely configurable interfaces for connecting various modules
  • Control of label printers, bad-board markers and FIFO buffers
  • Communication with MES systems
  • Support for M2M communication standards such as SMEMA, IPC-CFX, The Hermes Standard and JARAS 1014
  Combined inspection of SMD placement and wire bonds up to 25 µm
   
Inspection scope:  
  Inspection of conductive adhesive bond, missing conductive adhesives and excess conductive adhesive
  Reliable inspection of hidden connectors
Inspection of typical bond defects: Missing ball/stitch, ball/stitch position out of tolerance, ball/stitch geometry deviation, golf club, contaminated pad, missing wedge, wedge rotation out of tolerance, wedge geometry deviation, wedge position, contaminated landing area, capillary imprint, missing wire, defective wire course, insufficient clearance to adjacent wires, short circuit
   
Additional options: Optical character recognition (OCR), barcode (BC/DMC) recognition, color recognition, open area recognition
DIMENSIONS  
System housing: 1,493 mm x 1,631 mm x 2,251 mm (W x H x D)
  Width with xFastFlow: 1,933 mm
   
CAMERA TECHNOLOGY  
Detector: flat panel detectors (FPD), 14-bit grayscale value depth
Resolution: 6 - 30 μm/pixel (depending on the configuration)
Configuration: 1 FPD on X/Y table, 5 fixed FPDs (additional FDPs available upon request)
   
INSPECTION  
Inspection methods: 2D, 2.5D, 3D as X-ray only or combined AOI/AXI
Speed: AOI 65 cm²/s depending on the application, AXI speed is configuration-dependent
   
HANDLING  
PCB dimensions: 450 mm x 350 mm (L x W)
   
SOFTWARE  
User interface: Viscom EasyPro

ADVANTAGES AT A GLANCE

  • Combined bond AOI and bond AXI
  • Maximum inspection depth
  • Versatile camera module selection for thick and thin wires
  • High-throughput wire bond inspection
  • Maintenance-free sealed microfocus X-ray tube

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