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Inline Inspection of Heavy Inspection Objects with Maximum Precision

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3D AXI
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iX7059 Heavy Duty Inspection – fast inline inspection with maximum precision

Large, heavy, and solid assemblies – whether encased or as complete models – require 100% quality assurance, depending on the area of application. As a result, perfect-fit inline X-ray inspection in 2D, 2.5D, or 3D is the first choice for high current and high voltage electronics. This is because inspected components and flawless solder joints are the only way to guarantee the necessary functional reliability in cases where, for example, critical solder joints that have air inclusions of an excessive number or size could jeopardize heat dissipation in power electronics and lead to overheating. With its iX7059 product line, Viscom is setting a new standard for fast, high-precision inline X-ray inspection. The special transport system enables seamless handling of inspection objects on workpiece carriers or in soldering frames with a weight of up to 40 kg – a unique feature that offers huge advantages for trending segments such as e-mobility, new energies, and telecommunications.

 

Inspection Scope

  • Reliable inspection for heavy, solid, and encased components
  • Powerful X-rays with 130 kV or optionally 160 kV
  • One-of-a-kind transport concept for fast handling of workpiece carriers and soldering frames
  • High-precision inspection in 2D, 2.5D, and 3D
  • Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
  • Maximum inspection program optimization through integrated verification
  • Additional vertical slices for optimum analyses and dependable verification
  • High-quality 3D AXI volume calculation with planar CT
  • Global libraries, global calibration: transferability to all systems
  • Automated grayscale value calibration for consistent inspection results
  • Traceability, statistical process control, offline programming, multiline verification
  • Viscom Quality Uplink: effective networking and process optimization
  • Interfaces: SMEMA, IPC Hermes Standard (optional)
Scope of inspection: Air inclusions/blow holes (voids) in surface soldering, presence, offset, excessive/insufficient solder, solder bridge, solder balls, solder sputter, soldering defects, THT fill level and pin height, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted lead, billboarding, supine, twist, wick-up effect (optional)
DIMENSIONS  
Inspection housing: 1,493 mm x 1,654 mm x 2,207 mm (W x H x D)
   
X-RAY TECHNOLOGY  
X-ray tube: Sealed microfocus X-ray tube
High voltage: 130 kV (optional 160 kV)
Detector: Flat panel detectors type FPD T2 (T3 optional), 14-bit grayscale value depth
Resolution: 8 - 30 μm/pixel (depending on inspection object)
   
INSPECTION  
Inspection procedure: 2D, 2.5D, 3D
   
HANDLING  
Inspection object dimensions: 500 mm x 500 mm (L x W)
Inspection object weight: up to 40 kg
   
SOFTWARE  
User interface: Viscom vVision/EasyPro

ADVANTAGES AT A GLANCE

  • 100% quality assurance
  • Future-ready inline X-ray
  • Fast inspection of heavy electronics
  • Space-saving system design
  • Also ideal for the final assembly line
  • Rapid delivery times

AWARD WINNING INNOVATION

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