iS6059 SPI – excellent 3D solder and sinter paste inspection
Viscom’s powerful SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as volume, height, and shape as well as surface area, displacement, and smearing are accurately examined. The 3D inline system demonstrates decades of Viscom's experience in reliable, high-throughput solder paste inspection. The latest sensor technology with an orthogonal camera and four lateral views results in the highest inspection quality. Realistic color images ensure quick and clear verification. The FastFlow handling guarantees an extremely high throughput thanks to synchronous in- and outfeed of the assemblies. The system can achieve minimal handling times with minimal mechanical impact loads. Intelligent networking in the SMT line enhances process stability and efficiency.
Inspection scope
- Excellent defect identification for ultimate reliability
- Cutting-edge 3D camera technology
- High inspection speed
- Fast handling of PCBs
- End-to-end process analysis with Viscom Quality Uplink
- Closed-loop functions enhance quality and efficiency
- Integrated verification
- Flexible integration into existing productions
- Improved ergonomic design
- Global libraries, global calibration: transferability to all systems
- Traceability, offline programming, statistical process control
- Viscom Closed Loop: Intelligent communication between Viscom inspection systems and the paste printer and placement machine
- Independent real-time image processing with Viscom analysis tools
- Simple process analysis
- Optional connection to the digital multi-purpose platform vConnect
| Inspects solder paste deposits (pad sizes of 01005 components) and dispenser paste for surface, height and shape |
| Defects/defect features: too much/too little solder, missing solder, print displacement (X/Y offset), paste smearing |
| Optional: coplanarity, open area analysis, OCR, DMC |
| DIMENSIONS | |
| System housing: | 997 mm x 1756 mm x 1753 mm (39.3" x 69.1" x 69") (W x D x H) |
| CAMERA TECHNOLOGY | |
| 3D sensor technology: | XM-SPI-II |
| Z-resolution: | 0.1 µm |
| Z-range: | Up to 5 mm (0.2") |
| Angled view cameras | |
| Number of megapixel cameras: | 4 |
| Orthogonal camera | |
| Resolution: | 12 µm |
| Field of view: | 58 mm x 58 mm (2.3" x 2.3") |
| INSPECTION SPEED | Up to 90 cm²/s |
| HANDLING | |
| PCB dimensions: | 508 mm x 508 mm (20" x 20"); |
| long-board option available | |
| SOFTWARE | |
| User interface: | Viscom vVision/SI Easy Pro |
| Statistical process control: | Viscom vSPC/SPC, open interface (optional) |
| Verification station: | Viscom vVerify/HARAN |
| Remote diagnosis: | Viscom SRC (optional) |
| Programming station: | Viscom PST34 (optional) |
ADVANTAGES AT A GLANCE
- Latest 3D camera technology
- Ultra-fast inspection – also with dual-lane operation
- Shadow-free, seamless solder paste inspection
- Closed loop functions with solder paste printer and pick-and-place machine
- Effective process control and optimization in real time
