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iX7059 PCB Inspection
The new 3D X-ray generation for highly accurate and fast inline inspection of printed circuit boards with a unique, dynamic image acquisition approach. Inspection objects up to 15 kg Rapid inspectioning speed and extremely fast handling For: Solder joint inspection, THT assembly and selective solder joints, void inspection surface soldering, LEDs, server boards, 3D computer tomography
iX7059 Heavy Duty Inspection
The new 3D X-ray generation for highly accurate and fast inspection of large assemblies, such as high-voltage electronics and power electronics. Inspection objects up to 40 kg Handling of workpiece carriers and soldering frames For: Solder joint inspection, THT assemly and selective solder joints, void inspection glue joints, high voltage electronics, 3D computer tomography
Multitalent X8011-III
The flexible manual X-ray system is used for materials examination and solder joint inspection of high-end electronics. The X8011-III offers outstanding image quality, user-friendly operation, and fast programming. For: Solder joint inspection, THT selective solder inspection, void inspection surface soldering, 3D computed tomography, final inspection of equipment
Battery cell inspection
The Viscom subsidiary Exacom GmbH develops tailor-made X-ray solutions for high-precision battery inspection. The focus is on rapid image acquisition and handling of different cell types such as coin cells, cylindrical cells and pouch cells. For: Battery cell inspection, energy storage products