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iX7059 Heavy Duty Inspection
The new 3D X-ray generation for highly accurate and fast inspection of large assemblies, such as high-voltage electronics and power electronics. Inspection objects up to 40 kg Handling of workpiece carriers and soldering frames For: Solder joint inspection, THT assemly and selective solder joints, void inspection glue joints, high voltage electronics, 3D computer tomography
Multitalent X8011-III
The flexible manual X-ray system is used for materials examination and solder joint inspection of high-end electronics. The X8011-III offers outstanding image quality, user-friendly operation, and fast programming. For: Solder joint inspection, THT selective solder inspection, void inspection surface soldering, 3D computed tomography, final inspection of equipment
Battery cell inspection
The Viscom subsidiary Exacom GmbH develops tailor-made X-ray solutions for high-precision battery inspection. The focus is on rapid image acquisition and handling of different cell types such as coin cells, cylindrical cells and pouch cells. For: Battery cell inspection, energy storage products
iX7059 Module Inspection
Fully automated 3D X-ray inspection with integrated computed tomography for quality assurance of power semiconductors. For: THT assembly and selective solder joints, hidden blow holes (voids) in surface soldering
Microfocus X-ray tubes
Viscom develops and manufactures micro-focus X-ray tubes at the highest level. The product portfolio includes direct beam and transmission tubes with voltages up to 250 kV. In addition to product adaptations such as special mounting holes, Viscom also develops custom-made products. For: Micro-focus X-ray tubes
iX7059 Device Inspection
A new generation of X-rays for very fast 2D inspection of mobile devices such as mobile phones, tablets, notebooks, or wearables to ensure reliable quality assurance and product end control. For: Final inspection of complete products, mobile devices
Machine Vision
Wherever Viscom's standardized inline systems cannot be used directly, the “End of line inspection” product approach offers a flexible way to adapt to the specific task. Reach out to us! The application of Viscom standards for camera technology and software Wide range of resolutions and field of view sizes 2D and 3D inspection Integrates into customer-specific environments For: Final inspection of complete products, customer-specific solutions, direct copper bondes (DCB)
Combination system X7056-II
Combined 3D AOI and 3D AXI in one system — space-saving, powerful, and with extremely high throughput. The fast-flow option allows handling times of approximately 2.5 seconds. Ensures seamless quality control in the SMT line. For PCBs up to 450 mm x 350 mm (L x W). For: Component inspection, solder joint inspection, THT ssembly and selective solder joints, void inspection glue joints
X8068
The manual system is ideal for automatic X-ray inspection of heavier and larger inspection objects up to 722 mm in diameter. Due to the simple loading and unloading operations, larger individual objects, as well as product carriers, can be inspected. For: Solder joint inspection, THT assembly and selective solder joints, void inspection glue joints, 3D computed tomography, final inspection complete products
3D Computed Tomography
The combination of CT and a micro-focus X-ray tube non-destructive inspection on castings, electronic components, ceramic parts, and much more. The three-dimensional inspection method provides insight into the internal structure of the inspection object. Available for manual Viscom X-ray systems and 3D inline X-rays as an option. For: 3D computed tomography, final inspection of complete products