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productronica India 2024
09/18/2024 - 09/20/2024
BIEC
Delhi
India
International Trade Fair for Electronics Development and Production
productronica India showcases the entire value chain in electronics production in all industrial sectors. The fair has been one of the most important events in Asia since 2000.
Semicon Taiwan 2024
09/04/2024 - 09/06/2024
Taipei Nangang Exhibition Center
Taipei
Taiwan
Semicon Taiwan is an international trade fair for semiconductor technology and the most important trade event for the micro- and nanoelectronics industry in Taiwan. Topics include technologies for the development and manufacture of semiconductors, solar cells and other micro- and nanoelectronic products.
Michael Tröbs
Viscom AG Technical Sales Manager - Customer Care Team S2
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
michael.troebs@viscom.de +49 511 94996-973 +49 160 96910522 +49 511 94996-900
Torsten Pelzer
Viscom AG Vice President Sales
Carl-Buderus-Straße 9 - 15 30455 Hannover Germany
torsten.pelzer@viscom.de +49 511 94996-654 +49 173 3103-654 +49 511 94996-900
Sebastian Legierko
Viscom AG Sales Europe
Carl-Buderus-Str. 9-15 30455 Hannover Germany
sebastian.legierko@viscom.de +49 511 94996-849 +49 160 93607946 +49 511 94996-900
electronica 2024
11/12/2024 - 11/15/2024
Messe München
Munich
Germany
electronica—world's leading trade fair and conference for electronics
The entire electronics industry meets in one place: meet exhibitors in Munich from almost all sub-sectors of the electronics industry, from at least 50 countries around the world.
Axel Klapproth
Viscom AG Senior Technical Manager - Customer Care Team S2
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
Axel.Klapproth@viscom.de +49 511 94996-697
Premium: iS6059 PCB Inspection Plus
Enhanced 3D image quality and repeatability, thanks to 3D hardware acceleration. Character recognition of even taller components, made possible by greater orthogonal depth of field. Inspection devices are intelligently networked to improve machine communication. With its new XMplus-II camera technology and easy programmability, this innovative system from Viscom sets new standards in premium 3D AOI inspection. XMplus-II camera module 1 orthogonal and 8 inclined cameras Resolution: 20.4 µm/pixel…
Top- and Bottom-Side: iS6059 Double-Sided Inspection
Innovative iS6059 Double-Sided Inspection Highly effective inspection of PCB top and bottom sides to provide the most accurate inspection of components, solder joints and pin lengths using the most advanced 3D camera technology. 1 orth. and 8 angled cameras from above 1 orth. and 8 angled cameras from below Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection